公开(公告)号：US20030111601A1

公开(公告)日：2003-06-19

申请号：US10017262

申请日：2001-12-14

Applicant: KLA-Tencor Corporation

Inventor： David L. Adler ,  Matthew Marcus

IPC: G01N023/227 ,  H01J037/285

CPC classification number: G01N23/227 ,  H01J37/285 ,  H01J2237/2817

Abstract: A method of inspecting and imaging substrates with an electron beam. The method can include a illuminating the substrate with a photon beam to cause photoemission of electrons. A low energy electron beam can be used to prevent or reduce positive charging of the substrate. Reflected electrons and/or emitted photoelectrons can be imaged to review or inspect the substrate.

Abstract translation: 用电子束检查和成像基板的方法。 该方法可以包括用光子束照射衬底以引起电子的光电子发射。 可以使用低能电子束来防止或减少衬底的正电荷。 可以对反射的电子和/或发射的光电子进行成像以检查或检查衬底。