Abstract:
A defect inspecting apparatus is provided for generating a less distorted test image to reliably observe a surface of a sample for detecting defects thereon. The defect detecting apparatus comprises a primary electron beam source for irradiating a sample, electrostatic lenses for focusing secondary electrons emitted from the surface of the sample irradiated with the primary electron beam, a detector for detecting the secondary electrons, and an image processing unit for processing a signal from the detector. Further, a second electron source may be provided for emitting an electron beam irradiated to the sample, wherein the sample may be irradiated with the electron beam from the second electron source before it is irradiated with the primary electron beam from the first electron source for observing the sample. A device manufacturing method is also provided for inspecting devices under processing with high throughput using the defect detecting apparatus.
Abstract:
Forward scattering peaks of photoelectrons having different angular momenta is generated by radiating to a sample two rays of circularly polarized light that differ in a rotary direction. Two images of photoelectron diffraction patterns are formed by two-dimensionally detecting the photoelectron diffraction patterns formed with the photoelectron forward scattering peaks. The observer can three-dimensionally observe the structure in an atomic arrangement by observing these photoelectron diffraction pattern images with his or hers right and left eyes, respectively.
Abstract:
A method of inspecting and imaging substrates with an electron beam. The method can include a illuminating the substrate with a photon beam to cause photoemission of electrons. A low energy electron beam can be used to prevent or reduce positive charging of the substrate. Reflected electrons and/or emitted photoelectrons can be imaged to review or inspect the substrate.
Abstract:
An apparatus and method for inspecting a surface of a sample, particularly but not limited to a semiconductor device, using an electron beam is presented. The technique is called Secondary Electron Emission Microscopy (SEEM), and has significant advantages over both Scanning Electron Microscopy (SEM) and Low Energy Electron Microscopy (LEEM) techniques. In particular, the SEEM technique utilizes a beam of relatively high-energy primary electrons having a beam width appropriate for parallel, multi-pixel imaging. The electron energy is near a charge-stable condition to achieve faster imaging than was previously attainable with SEM, and charge neutrality unattainable with LEEM. The emitted electrons may be detected using a time delay integration detector.
Abstract:
The invention relates to an emission electron microscope, comprising an objective lens, an imaging system with at least one lens and a stigmator. The invention is characterized in that said microscope comprises a second, independent imaging system (K2), parallel to the first imaging system (K1) and two electron detector devices (25) and (27), by means of which two independent images are recorded: a real image and an image of the angle distribution of the electrons as a result of electronically switching the potentials of the deflector elements (13) and (17). Both identical deflector elements comprise pairs of spherical and concentric electrodes and are electron-optically separated from each other (13a), (13b) and (17a), (17b) by double the focal length thereof and turn the electron beam through an angle corresponding to (null) and (nullnull), which leads to a parallel shift of the electron beam. The electrode (13b) contains a passage (13c), which allows the electron drift along the electron-optical main axis (29a), whilst the deflection is switched off. Said emission electron microscope also comprises an electron source (8), arranged close to the electron-optical axis (29) of the objective lens, which emits primary electrons along the electron-optical axis (28) at an angle (null) to the electron-optical axis (29) of the objective lens, a contrast diaphragm system (4a) in a plane correlated to the focal plane of the objective and an image diaphragm system (11), in one of the image planes of the system.
Abstract:
A method of examining a sample, including: performing a first spectroscopic analysis of a surface portion of the sample when the sample surface portion is in a first electrical charge state; placing the sample surface portion in a second electrical charge state that is different from the first electrical charge state and performing a second spectroscopic analysis of the surface portion of the sample when the sample surface portion is in the second electrical charge state; and comparing the first spectroscopic analysis result with the second spectroscopic analysis result to obtain at least one of structural and electrical information about the sample.