公开(公告)号：US10572991B2

公开(公告)日：2020-02-25

申请号：US15837582

申请日：2017-12-11

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Michael Cook ,  Pavan Kumar ,  Kenong Wu

IPC: G06T7/00 ,  G06T7/73 ,  G06K9/62 ,  G06T7/33

Abstract: A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.

公开(公告)号：US20190139208A1

公开(公告)日：2019-05-09

申请号：US15837582

申请日：2017-12-11

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Michael Cook ,  Pavan Kumar ,  Kenong Wu

IPC: G06T7/00 ,  G06T7/73 ,  G06T7/33 ,  G06K9/62

Abstract: A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.