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公开(公告)号：US20190139208A1
公开(公告)日：2019-05-09
申请号：US15837582
申请日：2017-12-11
Applicant: KLA-Tencor Corporation
Inventor： Hong Chen , Michael Cook , Pavan Kumar , Kenong Wu
Abstract: A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.
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Patent Agency Ranking
公开(公告)号：US20180342051A1
公开(公告)日：2018-11-29
申请号：US15971536
申请日：2018-05-04
Applicant: KLA-TENCOR CORPORATION
Inventor： Abdurrahman Sezginer , Xiaochun Li , Pavan Kumar , Junqing Huang , Lisheng Gao , Grace H. Chen , Yalin Xiong , Hawren Fang
IPC: G06T7/00
Abstract: Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity. The computed reference image can minimize a norm of the difference of the test image and the computed reference image. A difference image between the test image and a computed reference image is determined. The computed reference image includes a linear combination of a second set of images.
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公开(公告)号：US11270430B2
公开(公告)日：2022-03-08
申请号：US15971536
申请日：2018-05-04
Applicant: KLA-TENCOR CORPORATION
Inventor： Abdurrahman Sezginer , Xiaochun Li , Pavan Kumar , Junqing Huang , Lisheng Gao , Grace H. Chen , Yalin Xiong , Hawren Fang
IPC: G06T7/00
Abstract: Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity. The computed reference image can minimize a norm of the difference of the test image and the computed reference image. A difference image between the test image and a computed reference image is determined. The computed reference image includes a linear combination of a second set of images.
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公开(公告)号：US10572991B2
公开(公告)日：2020-02-25
申请号：US15837582
申请日：2017-12-11
Applicant: KLA-Tencor Corporation
Inventor： Hong Chen , Michael Cook , Pavan Kumar , Kenong Wu
Abstract: A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.
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公开(公告)号：US09996942B2
公开(公告)日：2018-06-12
申请号：US15073617
申请日：2016-03-17
Applicant: KLA-Tencor Corporation
Inventor： Santosh Bhattacharyya , Pavan Kumar , Lisheng Gao , Thirupurasundari Jayaraman , Raghav Babulnath , Srikanth Kandukuri , Gangadharan Sivaraman , Karthikeyan Subramanian , Raghavan Konuru , Rahul Lakhawat
CPC classification number: G06T7/33 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
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公开(公告)号：US20160275672A1
公开(公告)日：2016-09-22
申请号：US15073617
申请日：2016-03-17
Applicant: KLA-Tencor Corporation
Inventor： Santosh Bhattacharyya , Pavan Kumar , Lisheng Gao , Thirupurasundari Jayaraman , Raghav Babulnath , Srikanth Kandukuri , Gangadharan Sivaraman , Karthikeyan Subramanian , Raghavan Konuru , Rahul Lakhawat
IPC: G06T7/00
CPC classification number: G06T7/33 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
Abstract translation: 提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统。 通常，这里描述的一些实施例被配置成用于将检测子系统产生的样品基本上精确地对准于试样的设计，尽管检查子系统输出中的设计变形。 此外，一些实施例被配置用于生成和/或使用可以在同一层的多个样本上共享的对准目标和用于将为样本生成的检查子系统输出对准样本的设计规则的设计规则。
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