公开(公告)号：US10036964B2

公开(公告)日：2018-07-31

申请号：US14656422

申请日：2015-03-12

Applicant: KLA-Tencor Corporation

Inventor： Bin-Ming Benjamin Tsai ,  Oreste Donzella ,  Pradeep Vukkadala ,  Jaydeep Sinha

IPC: G06F17/50 ,  G03F7/20

CPC classification number: G03F7/707 ,  G03F7/70783

Abstract: Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.

公开(公告)号：US20160239600A1

公开(公告)日：2016-08-18

申请号：US14656422

申请日：2015-03-12

Applicant: KLA-Tencor Corporation

Inventor： Bin-Ming Benjamin Tsai ,  Oreste Donzella ,  Pradeep Vukkadala ,  Jaydeep Sinha

IPC: G06F17/50

CPC classification number: G03F7/707 ,  G03F7/70783

Abstract: Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.

Abstract translation: 公开了用于优化晶片夹持和光刻控制的基于预测的系统和方法。 计算出当通过夹紧装置夹紧晶片时发生的变形，并用于控制夹紧装置的夹持参数。 夹头参数可以包括夹紧压力和夹紧顺序。 此外，还可以利用预测的失真来促进预期校正的应用。 控制夹持参数和/或应用预期校正有助于减少或最小化重叠错误。

公开(公告)号：US10788759B2

公开(公告)日：2020-09-29

申请号：US16049266

申请日：2018-07-30

Applicant: KLA-Tencor Corporation

Inventor： Bin-Ming Benjamin Tsai ,  Oreste Donzella ,  Pradeep Vukkadala ,  Jaydeep Sinha

IPC: G06F17/50 ,  G03F7/20

Abstract: Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.

公开(公告)号：US20180364579A1

公开(公告)日：2018-12-20

申请号：US16049266

申请日：2018-07-30

Applicant: KLA-Tencor Corporation

Inventor： Bin-Ming Benjamin Tsai ,  Oreste Donzella ,  Pradeep Vukkadala ,  Jaydeep Sinha

IPC: G03F7/20

CPC classification number: G03F7/707 ,  G03F7/70783

Abstract: Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.