公开(公告)号：US20170278236A1

公开(公告)日：2017-09-28

申请号：US15255605

申请日：2016-09-02

Applicant: KLA-Tencor Corporation

Inventor： Shifang Li ,  Lena Nicolaides ,  Paul Horn ,  Richard Graetz

IPC: G06T7/00 ,  H04N17/00 ,  H04N5/225 ,  G01B11/06 ,  G06T7/60

CPC classification number: G01B11/06 ,  G06T7/0004 ,  G06T2207/30148

Abstract: A system is configured to perform metrology on a front surface, a back surface opposite the front surface, and/or an edge between the front surface and the back surface of a wafer. This can provide all wafer metrology and/or metrology of thin films on the back surface of the wafer. In an example, the thickness and/or optical properties of a thin film on a back surface of a wafer can be determined using a ratio of a greyscale image of a bright field light emerging from the back surface of the wafer under test to that of a reference wafer.

公开(公告)号：US10563973B2

公开(公告)日：2020-02-18

申请号：US15255605

申请日：2016-09-02

Applicant: KLA-Tencor Corporation

Inventor： Shifang Li ,  Lena Nicolaides ,  Paul Horn ,  Richard Graetz

IPC: G06T7/00 ,  G01B11/06

Abstract: A system is configured to perform metrology on a front surface, a back surface opposite the front surface, and/or an edge between the front surface and the back surface of a wafer. This can provide all wafer metrology and/or metrology of thin films on the back surface of the wafer. In an example, the thickness and/or optical properties of a thin film on a back surface of a wafer can be determined using a ratio of a greyscale image of a bright field light emerging from the back surface of the wafer under test to that of a reference wafer.