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公开(公告)号：US10360671B2
公开(公告)日：2019-07-23
申请号：US15646808
申请日：2017-07-11
Applicant: KLA-Tencor Corporation
Inventor： Ravichander Rao , Gary Taan , Andreas Russ , Bjorn Brauer , Roger Davis , Bryant Mantiply , Swati Ramanathan , Karen Biagini
Abstract: Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.
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公开(公告)号：US20190019280A1
公开(公告)日：2019-01-17
申请号：US15646808
申请日：2017-07-11
Applicant: KLA-Tencor Corporation
Inventor： Ravichander Rao , Gary Taan , Andreas Russ , Bjorn Brauer , Roger Davis , Bryant Mantiply , Swati Ramanathan , Karen Biagini
CPC classification number: G06T7/001 , G01N21/8851 , G01N2021/8887 , G06T2207/20056 , G06T2207/30148 , G06T2207/30164
Abstract: Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.
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