公开(公告)号：US10372114B2

公开(公告)日：2019-08-06

申请号：US15299616

申请日：2016-10-21

Applicant: KLA-Tencor Corporation

Inventor： Karen Biagini ,  Bryant Stanford Mantiply ,  Ravichander Jayantha Rao ,  Gary Taan

IPC: G05B19/418 ,  H01L21/67 ,  H01L21/66

Abstract: A process control technique uses production data from multiple manufacturing tools and multiple inspection or metrology tools. Total measurement uncertainty (TMU) can be calculated on the production data, which can include measurements of one or more devices manufactured using the manufacturing tools. Manufacturing steps can be ranked or otherwise compared by TMU. All production modes and recipes can be continually monitored using production data.

公开(公告)号：US20190019280A1

公开(公告)日：2019-01-17

申请号：US15646808

申请日：2017-07-11

Applicant: KLA-Tencor Corporation

Inventor： Ravichander Rao ,  Gary Taan ,  Andreas Russ ,  Bjorn Brauer ,  Roger Davis ,  Bryant Mantiply ,  Swati Ramanathan ,  Karen Biagini

IPC: G06T7/00 ,  G01N21/88

CPC classification number: G06T7/001 ,  G01N21/8851 ,  G01N2021/8887 ,  G06T2207/20056 ,  G06T2207/30148 ,  G06T2207/30164

Abstract: Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.

公开(公告)号：US10360671B2

公开(公告)日：2019-07-23

申请号：US15646808

申请日：2017-07-11

Applicant: KLA-Tencor Corporation

Inventor： Ravichander Rao ,  Gary Taan ,  Andreas Russ ,  Bjorn Brauer ,  Roger Davis ,  Bryant Mantiply ,  Swati Ramanathan ,  Karen Biagini

IPC: G06T7/00 ,  G01N21/88

Abstract: Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.

公开(公告)号：US20180113441A1

公开(公告)日：2018-04-26

申请号：US15299616

申请日：2016-10-21

Applicant: KLA-Tencor Corporation

Inventor： Karen Biagini ,  Bryant Stanford Mantiply ,  Ravichander Jayantha Rao ,  Gary Taan

IPC: G05B19/418 ,  H01L21/67 ,  H01L21/66

CPC classification number: G05B19/4184 ,  G05B2219/37525 ,  H01L22/20 ,  Y02P90/14 ,  Y02P90/20

Abstract: A process control technique uses production data from multiple manufacturing tools and multiple inspection or metrology tools. Total measurement uncertainty (TMU) can be calculated on the production data, which can include measurements of one or more devices manufactured using the manufacturing tools. Manufacturing steps can be ranked or otherwise compared by TMU. All production modes and recipes can be continually monitored using production data.