Methods and systems for chucking a warped wafer

    公开(公告)号:US10468288B2

    公开(公告)日:2019-11-05

    申请号:US15383207

    申请日:2016-12-19

    摘要: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.

    Methods and Systems for Chucking a Warped Wafer

    公开(公告)号:US20180108559A1

    公开(公告)日:2018-04-19

    申请号:US15383207

    申请日:2016-12-19

    IPC分类号: H01L21/683 H01L21/687

    摘要: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.