公开(公告)号：US20190288028A1

公开(公告)日：2019-09-19

申请号：US16355265

申请日：2019-03-15

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

IPC: H01L27/148 ,  H01L27/146 ,  H04N5/357 ,  H04B3/32

Abstract: First and second images of a semiconductor die or portion thereof are generated. Generating each image includes performing a respective instance of time-domain integration (TDI) along a plurality of pixel columns in an imaging sensor, while illuminating the imaging sensor with light scattered from the semiconductor die or portion thereof. The plurality of pixel columns comprises pairs of pixel columns in which the pixel columns are separated by respective channel stops. While performing a first instance of TDI to generate the first image, a first bias is applied to electrically conductive contacts of the channel stops. While performing a second instance of TDI to generate the second image, a second bias is applied to the electrically conductive contacts of the channel stops. Defects in the semiconductor die or portion thereof are identified using the first and second images.

公开(公告)号：US10734438B2

公开(公告)日：2020-08-04

申请号：US16297534

申请日：2019-03-08

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

IPC: H01L27/148 ,  H01L27/146 ,  H04B3/32 ,  H04N5/357 ,  G06F1/10 ,  H03L7/081 ,  H04N5/376

Abstract: An image sensor is provided that includes a pixel array divided into a plurality of pixel groups. Each pixel group is clocked by a respective plurality of horizontal-register clocks. Clock signals for the image sensor are adjusted. Adjusting the clock signals includes phase-shifting each plurality of horizontal-register clocks by a respective phase delay of a plurality of phase delays. The phase delays are evenly spaced and are spaced symmetrically about zero. With the clock signals adjusted, a target is imaged using the image sensor.

公开(公告)号：US20190288019A1

公开(公告)日：2019-09-19

申请号：US16297534

申请日：2019-03-08

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

IPC: H01L27/146 ,  H04N5/376 ,  G06F1/10 ,  H03L7/081

Abstract: An image sensor is provided that includes a pixel array divided into a plurality of pixel groups. Each pixel group is clocked by a respective plurality of horizontal-register clocks. Clock signals for the image sensor are adjusted. Adjusting the clock signals includes phase-shifting each plurality of horizontal-register clocks by a respective phase delay of a plurality of phase delays. The phase delays are evenly spaced and are spaced symmetrically about zero. With the clock signals adjusted, a target is imaged using the image sensor.

公开(公告)号：US10923526B2

公开(公告)日：2021-02-16

申请号：US16355265

申请日：2019-03-15

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chem ,  Stephen Biellak

IPC: H01L27/148 ,  H01L27/146 ,  H04B3/32 ,  H04N5/357 ,  G06F1/10 ,  H03L7/081 ,  H04N5/376

Abstract: First and second images of a semiconductor die or portion thereof are generated. Generating each image includes performing a respective instance of time-domain integration (TDI) along a plurality of pixel columns in an imaging sensor, while illuminating the imaging sensor with light scattered from the semiconductor die or portion thereof. The plurality of pixel columns comprises pairs of pixel columns in which the pixel columns are separated by respective channel stops. While performing a first instance of TDI to generate the first image, a first bias is applied to electrically conductive contacts of the channel stops. While performing a second instance of TDI to generate the second image, a second bias is applied to the electrically conductive contacts of the channel stops. Defects in the semiconductor die or portion thereof are identified using the first and second images.

公开(公告)号：US10903258B2

公开(公告)日：2021-01-26

申请号：US16153495

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

IPC: H01L27/146 ,  H01L27/148

Abstract: A back-illuminated image sensor includes a first pixel, a second pixel, and a channel stop situated between the first pixel and the second pixel to isolate the first pixel from the second pixel. The channel stop includes a LOCOS structure and a region of doped silicon beneath the LOCOS structure. The back-illuminated image sensor also includes a first electrically conductive contact that extends through the LOCOS structure and forms an ohmic contact with the region of doped silicon. The first electrically conductive contact may be grounded, negatively biased, or positively biased, depending on the application.

公开(公告)号：US20190109163A1

公开(公告)日：2019-04-11

申请号：US16153495

申请日：2018-10-05

Applicant: KLA-Tencor Corporation

Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

IPC: H01L27/146 ,  H01L27/148

Abstract: A back-illuminated image sensor includes a first pixel, a second pixel, and a channel stop situated between the first pixel and the second pixel to isolate the first pixel from the second pixel. The channel stop includes a LOCOS structure and a region of doped silicon beneath the LOCOS structure. The back-illuminated image sensor also includes a first electrically conductive contact that extends through the LOCOS structure and forms an ohmic contact with the region of doped silicon. The first electrically conductive contact may be grounded, negatively biased, or positively biased, depending on the application.