公开(公告)号：US20030142860A1

公开(公告)日：2003-07-31

申请号：US10359444

申请日：2003-02-04

Applicant: KLA-Tencor Technologies Corporation

Inventor： Lance A. Glasser ,  Jun Ye ,  Shauh-Teh Juang ,  David S. Alles ,  James N. Wiley

IPC: G06K009/00

CPC classification number: G03F1/84

Abstract: A reusable circuit design for use with electronic design automation EDA tools in designing integrated circuits is disclosed, as well as reticle inspection and fabrication methods that are based on such reusable circuit design. The reusable circuit design is stored on a computer readable medium and contains an electronic representation of a layout pattern for at least one layer of the circuit design on an integrated circuit. The layout pattern includes a flagged critical region which corresponds to a critical region on a reticle or integrated circuit that is susceptible to special inspection or fabrication procedures. In one aspect of the reusable circuit design, the special analysis is performed during one from a group consisting of reticle inspection, reticle production, integrated circuit fabrication, and fabricated integrated circuit inspection.

Abstract translation: 公开了一种用于设计电子设计自动化EDA工具的可复用电路设计，以及基于这种可重复使用的电路设计的标线检查和制造方法。 可重复使用的电路设计存储在计算机可读介质上，并且包含用于集成电路上的至少一层电路设计的布局图案的电子表示。 布局图案包括标记的临界区域，其对应于易于进行特殊检查或制造程序的掩模版或集成电路上的临界区域。 在可重复使用的电路设计的一个方面，特别的分析是在一个由标线检查，标线制作，集成电路制造和制造的集成电路检查组成的组中进行的。

公开(公告)号：US20030091224A1

公开(公告)日：2003-05-15

申请号：US10314030

申请日：2002-12-04

Applicant: KLA-Tencor Technologies Corporation

Inventor： James N. Wiley ,  Jun Ye ,  Shauh-Teh Juang ,  David S. Alles ,  Yen-Wen Lu ,  Yu Cao

IPC: G06K009/00

CPC classification number: G06T7/001 ,  G06T2207/30148

Abstract: Disclosed is a method of inspecting a reticle defining a circuit layer pattern that is used within a corresponding semiconductor process to generate corresponding patterns on a semiconductor wafer. A test image of the reticle is provided, and the test image has a plurality of test characteristic values. A baseline image containing an expected pattern of the test image is also provided. The baseline image has a plurality of baseline characteristic values that correspond to the test characteristic values. The test characteristic values are compared to the baseline characteristic values such that a plurality of difference values are calculated for each pair of test and baseline characteristic values. Statistical information is also collected.