公开(公告)号：US20030096436A1

公开(公告)日：2003-05-22

申请号：US10338936

申请日：2003-01-07

Applicant: KLA-Tencor Technologies Corporation

Inventor： Akella V. S. Satya ,  Gustavo A. Pinto ,  David L. Adler ,  Robert Thomas Long ,  Neil Richardson ,  Kurt H. Weiner ,  David J. Walker ,  Lynda C. Mantalas

IPC: H01L021/00

CPC classification number: H01L22/34 ,  G01N21/66 ,  G01N21/956 ,  G01R31/2884 ,  G01R31/307 ,  H01J2237/2817

Abstract: Disclosed is a semiconductor die having a scanning area. The semiconductor die includes a first plurality of test structures wherein each of the test structures in the first plurality of test structures is located entirely within the scanning area. The semiconductor die further includes a second plurality of test structures wherein each of the test structures in the first plurality of test structures is located only partially within the scanning area. The test structures are arranged so that a scan of the scanning area results in detection of defects outside of the scanning area.

公开(公告)号：US20020130260A1

公开(公告)日：2002-09-19

申请号：US09912732

申请日：2001-07-23

Applicant: KLA-Tencor Technologies Corporation

Inventor： Mark A. McCord ,  David Walker ,  Jun Pei ,  Neil Richardson

IPC: H01J037/256 ,  H01J037/28 ,  G01N023/225

CPC classification number: H01J37/28 ,  G01N23/225 ,  H01J2237/004 ,  H01J2237/2817

Abstract: Disclosed are methods and apparatus for simultaneously flooding a sample (e.g., a semiconductor wafer) to control charge and inspecting the sample. The apparatus includes a charged particle beam generator arranged to generate a charged particle beam substantially towards a first portion of the sample and a flood gun for generating a second beam towards a second portion of the sample. The second beam is generated substantially simultaneously with the inspection beam. The apparatus further includes a detector arranged to detect charged particles originating from the sample portion. In a further implementation, the apparatus further includes an image generator for generating an image of the first portion of the sample from the detected particles. In one embodiment, the sample is a semiconductor wafer. In a method aspect, a first area of a sample is flooded with a flood beam to control charge on a surface of the sample. A second area of the sample is inspected with an inspection beam. The second area comprises at least a portion of the first area flooded by the flood beam. The inspection beam moves in tandem with the flood beam. In another aspect of the present invention, methods and apparatus are provided for controlling the charge buildup of an area of the sample by an electrode having a voltage applied to it and through which the flood beam and charged particles emitted from the area of the sample can pass.

Abstract translation: 公开了用于同时淹没样品（例如，半导体晶片）以控制电荷并检查样品的方法和装置。 该装置包括带电粒子束发生器，其布置成基本上朝向样品的第一部分产生带电粒子束，以及用于产生朝向样品的第二部分的第二束的泛喷枪。 第二光束基本上与检查光束同时产生。 该装置还包括检测器，其被布置成检测源自样品部分的带电粒子。 在另一实施方式中，该装置还包括图像发生器，用于从检测到的粒子生成样品的第一部分的图像。 在一个实施例中，样品是半导体晶片。 在方法方面，样品的第一区域用泛光束淹没以控制样品表面上的电荷。 用检查梁检查样品的第二个区域。 第二区域包括由洪水束淹没的第一区域的至少一部分。 检查梁与洪水束一起移动。 在本发明的另一方面，提供了一种方法和装置，用于通过施加有电压的电极来控制样品区域的电荷积累，通过该电极，从样品区域发射的泛光束和带电粒子可以 通过。