公开(公告)号：US20230100174A1

公开(公告)日：2023-03-30

申请号：US17910253

申请日：2020-12-28

Applicant: KOA CORPORATION

Inventor： Miyahito KINOSHITA

IPC: G01R1/20 ,  G01R19/00

Abstract: A current sensing device including: an insulating resin substrate; a current sensing element arranged in the resin substrate; a current wire provided via an insulating layer with respect to the current sensing element to flow a current through the current sensing element; a plurality of current vias connecting the current sensing element and the current wire through the insulating layer; and a voltage sensing via connected to the current sensing element to measure a voltage drop.

公开(公告)号：US20240347237A1

公开(公告)日：2024-10-17

申请号：US18579460

申请日：2022-06-22

Applicant: KOA Corporation

Inventor： Tomoki IGUCHI ,  Miyahito KINOSHITA ,  Kohji ETO ,  Tomofumi NOGUCHI

IPC: H01C1/14 ,  H01C17/245

CPC classification number: H01C1/14 ,  H01C17/245

Abstract: A metal plate resistor that is a built-in chip resistor for substrate has a plate shape including a resistance body, a first electrode bonded to a first end of the resistance body with a first clad portion, and a second electrode bonded to a second end of the resistance body with a second clad portion.