公开(公告)号：US20230040566A1

公开(公告)日：2023-02-09

申请号：US17759510

申请日：2020-12-28

Applicant: KOA Corporation

Inventor： Yohei TOKIWA ,  Kohji ETO ,  Tomofumi NOGUCHI ,  Reina KANEKO

IPC: H01C1/14

Abstract: A resistor contains a resistance body and a pair of electrodes (a first electrode body and a second electrode body), wherein end surfaces of the resistance body are respectively abutted to and bonded to end surfaces of the electrodes (a first electrode body and a second electrode body), the electrodes (a first electrode body and a second electrode body) each includes a main body portion and a leg portion, the leg portion protruding from the main body portion in the mounting surface of the resister, and a length dimension of the resistor is equal to or shorter than 3.2 mm.

公开(公告)号：US20240347237A1

公开(公告)日：2024-10-17

申请号：US18579460

申请日：2022-06-22

Applicant: KOA Corporation

Inventor： Tomoki IGUCHI ,  Miyahito KINOSHITA ,  Kohji ETO ,  Tomofumi NOGUCHI

IPC: H01C1/14 ,  H01C17/245

CPC classification number: H01C1/14 ,  H01C17/245

Abstract: A metal plate resistor that is a built-in chip resistor for substrate has a plate shape including a resistance body, a first electrode bonded to a first end of the resistance body with a first clad portion, and a second electrode bonded to a second end of the resistance body with a second clad portion.

公开(公告)号：US20240177892A1

公开(公告)日：2024-05-30

申请号：US18552178

申请日：2022-03-16

Applicant: KOA Corporation

Inventor： Reina KANEKO ,  Tomofumi NOGUCHI ,  Yoichi SAKAI ,  Junpei YAMAMOTO ,  Tomoki IGUCHI

IPC: H01C1/032 ,  H01C17/02 ,  H01C17/26

CPC classification number: H01C1/032 ,  H01C17/02 ,  H01C17/265

Abstract: Provided is a resistor provided with a resistance body and electrodes provided on the resistance body, and the resistance body has an oxide film on a surface.

公开(公告)号：US20230146171A1

公开(公告)日：2023-05-11

申请号：US17759487

申请日：2020-12-25

Applicant: KOA Corporation

Inventor： Yohei TOKIWA ,  Kohji ETO ,  Tomofumi NOGUCHI ,  Reina KANEKO

IPC: H01C1/14 ,  H01C17/00

CPC classification number: H01C1/14 ,  H01C17/006

Abstract: A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.