COPPER ALLOY MATERIAL AND SHUNT RESISTOR
    4.
    发明公开

    公开(公告)号:US20240200168A1

    公开(公告)日:2024-06-20

    申请号:US18529604

    申请日:2023-12-05

    CPC classification number: C22C9/05 G01R1/203

    Abstract: A copper alloy material having a low volume resistivity, a low TCR and a small thermal electromotive force with respect to copper and a shunt resistor comprising a resistive body formed by the copper alloy material are provided. The copper-manganese-based copper alloy material includes 4.5-5.5 mass % of manganese, 0.1-0.3 mass % of iron, 0.1-0.5 mass % of tin, and a balance being copper. A volume resistivity is 15-25 μΩ·cm. An absolute value of TCR is 150×10−6/K or less. A thermal electromotive force with respect to copper is 1 μV/K or less. A resistance value change is −0.3% to 0% in a heat resistance test of 175° C. for 3000 hours.

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