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公开(公告)号：US20230073723A1
公开(公告)日：2023-03-09
申请号：US17789725
申请日：2021-05-31
发明人： Guk HAN , Jae Hwan LEE , Duk Young LEE , Chan Woo PARK
摘要： An electronic apparatus according to various embodiments of the present disclosure may include: a communication circuit that is communicatively connected to a solder printing apparatus and a measurement apparatus; one or more memories; and one or more processors. One or more processors may be configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield.
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2.发明申请公开(公告)号：US20220142028A1
公开(公告)日：2022-05-05
申请号：US17235551
申请日：2021-04-20
发明人： Duk Young LEE , Jae Hwan LEE , Jin Hyung TAK , Chan Woo PARK , Guk HAN
IPC分类号： H05K13/08 , G05B19/418
摘要： The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.
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公开(公告)号：US20190269017A1
公开(公告)日：2019-08-29
申请号：US16229421
申请日：2018-12-21
发明人： Duk Young LEE , Chan Woo PARK , Tae Min CHOI , Joanna HONG
摘要： An apparatus, a recording medium, and a method for generating a control parameter of a screen printer are disclosed. The apparatus includes a memory that stores a simulation model configured to derive predictive inspection information on a printed state of solder paste based on a plurality of control parameters of the screen printer; a communication circuit configured to receive first inspection information on a plurality of solder pastes printed by the screen printer based on a first control parameter, and a processor electrically connected to the memory and the communication circuit. The processor obtains first predictive inspection information by applying the first control parameter to the simulation model, generates a plurality of candidate control parameters based on the first predictive inspection information, determines a plurality of second control parameters among the candidate control parameters, and transmits the plurality of second control parameters to the screen printer via the communication circuit.
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