公开(公告)号：US20230164923A1

公开(公告)日：2023-05-25

申请号：US17989989

申请日：2022-11-18

Applicant: KOLLMORGEN CORPORATION

Inventor： Jeffery Todd BREWSTER ,  Heather Cassidy HAWLEY ,  William Edward ANDERSON, IV ,  Tyler William WOOD ,  George Edward MIDKIFF ,  Elizabeth CANTANDO

IPC: H05K3/34

CPC classification number: H05K3/3457 ,  H05K2203/162 ,  H05K2203/166

Abstract: A printed circuit board has a solder joint inspection system including a substrate surface having at least one solder pad thereon, at least one conductor wire having an end attached to the at least one solder pad, and a first inspection feature. A first inspection feature is marked on the substrate surface adjacent to the at least one solder pad to define a conductor end zone on the at least one solder pad. The end of the conductor wire is in the conductor end zone when properly attached. The at least one solder pad may define a second inspection feature to mark an extent to which the at least one solder pad is covered by a flow of solder when the wire is properly attached.