公开(公告)号：US20230163494A1

公开(公告)日：2023-05-25

申请号：US17989909

申请日：2022-11-18

Applicant: KOLLMORGEN CORPORATION

Inventor： Jeffery Todd BREWSTER ,  William Edward ANDERSON, IV ,  Tyler William WOOD ,  Elizabeth Cantando

IPC: H01R12/53 ,  H05K1/11

CPC classification number: H01R12/53 ,  H05K1/11 ,  H05K2201/10189

Abstract: A strain relief plug to restrict movement of wires on a printed circuit board, the strain relief plug having an elongated stem along a vertical axis of the strain relief plug. The strain relief plug has an in-board flange defined by the elongated stem, the in-board flange configured to seat in a bore defined by the printed circuit board. The strain relief plug has an anchor defined by a first end of the elongated stem configured to prevent the strain relief plug from releasing from the printed circuit board. The strain relief plug has a bar defined by a second end of the elongated stem and transverse the vertical axis, the bar forming wire channels. The strain relief plug provides strain relief for wires on the printed circuit board of an electric motor in a vertical dimension resembling the thickness of the printed circuit board.

公开(公告)号：US20230164923A1

公开(公告)日：2023-05-25

申请号：US17989989

申请日：2022-11-18

Applicant: KOLLMORGEN CORPORATION

Inventor： Jeffery Todd BREWSTER ,  Heather Cassidy HAWLEY ,  William Edward ANDERSON, IV ,  Tyler William WOOD ,  George Edward MIDKIFF ,  Elizabeth CANTANDO

IPC: H05K3/34

CPC classification number: H05K3/3457 ,  H05K2203/162 ,  H05K2203/166

Abstract: A printed circuit board has a solder joint inspection system including a substrate surface having at least one solder pad thereon, at least one conductor wire having an end attached to the at least one solder pad, and a first inspection feature. A first inspection feature is marked on the substrate surface adjacent to the at least one solder pad to define a conductor end zone on the at least one solder pad. The end of the conductor wire is in the conductor end zone when properly attached. The at least one solder pad may define a second inspection feature to mark an extent to which the at least one solder pad is covered by a flow of solder when the wire is properly attached.