公开(公告)号：US10266504B2

公开(公告)日：2019-04-23

申请号：US15322946

申请日：2015-06-30

Applicant: KOLON INDUSTRIES, INC.

Inventor： Hee Jin Cho ,  Do Kyung Sung ,  Ki Hyun Park ,  Sang Hun Park ,  Hyun Soo Kagn

IPC: C08G61/00 ,  C07D265/14 ,  C08G61/12 ,  C07D265/12 ,  C07D413/10

Abstract: Disclosed is a polybenzoxazime precursor and a method of preparing the same. The polybenzoxazime precursor is used to prepare a hardened material having improved thermal characteristics, having high thermal and flame-retardant characteristics while maintaining its excellent electrical characteristics, or having high thermal and electrical characteristics, thus being available for use in a copper clad laminate, a semiconductor encapsulate, a printed circuit board, an adhesive, a paint, and a mold.

公开(公告)号：US10144716B2

公开(公告)日：2018-12-04

申请号：US15532576

申请日：2015-12-07

Applicant: KOLON INDUSTRIES, INC.

Inventor： Hee Jin Cho ,  Do Kyung Sung ,  Ki Hyun Park ,  Sang Hun Park

IPC: C07D265/14 ,  C07D265/12 ,  C07D265/10 ,  C08G8/10 ,  C08K5/18 ,  C08G61/12

Abstract: This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.