专利检索 ap:("KONICA MINOLTA LABORATORY U.S.A., INC.") AND inv:"Karsten Bruening" 第 1 页

1.

发明申请
FABRICATION PROCESS FOR FLIP CHIP BUMP BONDS USING NANO-LEDS AND CONDUCTIVE RESIN 审中-公开

公开(公告)号：US20200305288A1

公开(公告)日：2020-09-24

申请号：US16359125

申请日：2019-03-20

申请人： KONICA MINOLTA LABORATORY U.S.A., INC.

发明人： Karsten Bruening , Jun Amano

IPC分类号： H05K3/40 , H05K3/30

摘要： A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 μm using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 μm, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.

2.

发明授权
Fabrication process for flip chip bump bonds using nano-LEDs and conductive resin 有权

公开(公告)号：US11166384B2

公开(公告)日：2021-11-02

申请号：US16359125

申请日：2019-03-20

申请人： KONICA MINOLTA LABORATORY U.S.A., INC.

发明人： Karsten Bruening , Jun Amano

IPC分类号： H05K3/40 , H05K3/30 , H01L33/32 , H01L33/24 , H01L27/15 , H05K1/18

摘要： A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 μm using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 μm, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.