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公开(公告)号:US11161988B2
公开(公告)日:2021-11-02
申请号:US15920261
申请日:2018-03-13
Inventor: KyoungWook Paik , DalJin Yoon , SangHoon Lee
IPC: H05K3/32 , C09D5/24 , H05K3/36 , C09D127/14 , C09D109/00 , C09D133/20 , C09D177/06 , C09J7/24 , C09J7/25 , H05K1/14 , C09D177/02 , C09D7/65
Abstract: Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.
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公开(公告)号:US20180298206A1
公开(公告)日:2018-10-18
申请号:US15920261
申请日:2018-03-13
Inventor: KyoungWook Paik , DalJin Yoon , SangHoon Lee
IPC: C09D5/24 , H05K1/14 , H05K3/36 , C09D127/14 , C09D109/00 , C09D133/20 , C09D177/06 , C09J7/24 , C09J7/25
Abstract: Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.
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