公开(公告)号：US20180090302A1

公开(公告)日：2018-03-29

申请号：US15827929

申请日：2017-11-30

Applicant: KOREA BASIC SCIENCE INSTITUTE

Inventor： Dong Chan SEOK ,  Yong Ho JUNG ,  Hyun Young JEONG

IPC: H01J37/32 ,  B01J19/08 ,  H05H1/48 ,  H05H1/24

CPC classification number: H01J37/32568 ,  B01J19/088 ,  B01J2219/0835 ,  B01J2219/0879 ,  H01J37/32348 ,  H05H1/48 ,  H05H2001/2412

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

公开(公告)号：US20200216954A1

公开(公告)日：2020-07-09

申请号：US16644440

申请日：2018-11-01

Applicant: KOREA BASIC SCIENCE INSTITUTE

Inventor： Yong Sup CHOI ,  Kang Il LEE ,  Dong Chan SEOK ,  Soo Ouk JANG ,  Jong Sik KIM ,  Seung Ryul YOO

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/56

Abstract: An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.

公开(公告)号：US20150348760A1

公开(公告)日：2015-12-03

申请号：US14409399

申请日：2013-12-06

Applicant: KOREA BASIC SCIENCE INSTITUTE

Inventor： Dong Chan SEOK ,  Yong Ho JUNG ,  Hyun Young JEONG

IPC: H01J37/32

CPC classification number: H01J37/32532 ,  B01J19/088 ,  B01J2219/083 ,  B01J2219/0879 ,  H01J37/32009 ,  H01J37/32348 ,  H01J37/32568 ,  H05H1/2406 ,  H05H2001/2412 ,  H05H2001/2431

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.

Abstract translation: 公开了一种粉末等离子体处理装置。 粉末等离子体处理装置是圆形表面放电等离子体组件的粉末等离子体处理装置，该装置包括用作圆形表面放电等离子体组件的外表面的板状电极层，设置在内表面上的绝缘层 板状电极层和设置在绝缘层上的等离子体产生电极，其中圆形表面放电等离子体模块旋转，向等离子体发生电极和板状电极层施加交流电压，以在等离子体发生电极周围产生等离子体 等离子体产生电极和用于等离子体处理的粉末由圆形表面放电等离子体模块内的等离子体处理。

公开(公告)号：US20180019105A1

公开(公告)日：2018-01-18

申请号：US15719128

申请日：2017-09-28

Applicant: KOREA BASIC SCIENCE INSTITUTE

Inventor： Dong Chan SEOK ,  Yong Ho JUNG ,  Hyun Young JEONG

IPC: H01J37/32 ,  H05H1/24 ,  B01J19/08

CPC classification number: H01J37/32532 ,  B01J19/088 ,  B01J2219/083 ,  B01J2219/0879 ,  H01J37/32009 ,  H01J37/32348 ,  H01J37/32568 ,  H05H1/2406 ,  H05H2001/2412 ,  H05H2001/2431

Abstract: A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus is a powder plasma processing apparatus of a circular surface discharge plasma module, and the apparatus includes a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module, an insulating layer disposed on an internal surface of the plate-like electrode layer, and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.