公开(公告)号：US20170312535A1

公开(公告)日：2017-11-02

申请号：US15493302

申请日：2017-04-21

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Jinseok KIM ,  Jeiwon CHO ,  Hyungdal PARK ,  Yeowool HUH

IPC: A61N2/00 ,  H05K1/02 ,  H01F41/04 ,  H01F27/28 ,  A61N2/02 ,  A61B5/04 ,  H05K1/16 ,  A61B5/01

CPC classification number: A61N2/006 ,  A61B5/01 ,  A61B5/04001 ,  A61N2/02 ,  H01F5/003 ,  H01F7/20 ,  H01F27/2804 ,  H01F41/041 ,  H01F2027/2809 ,  H05K1/0265 ,  H05K1/165

Abstract: A neural probe structure includes a probe which is inserted into a living body, and a magnetic field inductor which is formed in the probe, wherein when a power source is supplied, the magnetic field inductor generates a magnetic field and applies magnetic stimulation to a target site of the living body into which the probe is inserted. A method for manufacturing the neural probe structure includes forming a first pattern on a first substrate and filling the first pattern with a conductor, stacking a second substrate on the first substrate, and forming a second pattern connected to the first pattern on the second substrate and filling the second pattern with a conductor, wherein the first substrate and the second substrate form the probe, and the conductor of the first pattern and the conductor of the second pattern form the magnetic field inductor.

公开(公告)号：US20180043156A1

公开(公告)日：2018-02-15

申请号：US15672297

申请日：2017-08-09

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Jeiwon CHO ,  Jinseok KIM ,  Hyungdal PARK ,  Yeowool HUH

IPC: A61N1/36 ,  A61H23/02 ,  A61N2/00

Abstract: A body stimulating structure includes a body which is attached to an internal organ of a living body, and a magnetic field inductor formed in the body, wherein when power is supplied, the magnetic field inductor produces a magnetic field and applies magnetic stimulation to a target site of the internal organ of the living body to which the body is attached. A method for manufacturing the body stimulating structure includes: forming a first pattern on a first substrate and filling the first pattern with a conductor; stacking a second substrate on the first substrate; and forming a second pattern connected to the first pattern on the second substrate and filling the second pattern with a conductor.