公开(公告)号：US20040256748A1

公开(公告)日：2004-12-23

申请号：US10679434

申请日：2003-10-07

Applicant: Korea Research Institute Of Chemical Technology and Unitech Co., Ltd

Inventor： Sang Il Seok ,  Bok Yeop Ahn

IPC: B01J013/02

CPC classification number: B01J13/02 ,  Y10T428/2985 ,  Y10T428/2989 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: The present invention relates to a process for preparing silica microcapsules and more particularly, to a process for preparing silica microcapsules comprising the steps of dissolving tetraethyl orthosilicate (TEOS) into an aqueous solution containing a hydrolysis catalyst to control a degree of hydrolysis and contribute hydrophilicity or lipophilicity, adding a core material and an appropriate amount of aminopropyltrialkoxysilane(APS) as a gelling agent into the solution, and emulsifying and dispersing the resulting solution to a solution having a polarity opposite to that of the core material to microcapsulate by coating the core material with silica shell via a sol-gel reaction. The process for preparing microcapsules of the present invention reduces environmental pollution compared to conventional processes using an alkali gelling agent such as an ammonia solution, and are suitable for both organic or inorganic core materials having hydrophilic or lipophilic property.

Abstract translation: 本发明涉及一种制备二氧化硅微胶囊的方法，更具体地说，涉及一种制备二氧化硅微胶囊的方法，包括以下步骤：将原硅酸四乙酯（TEOS）溶解在含有水解催化剂的水溶液中以控制水解度并提供亲水性，或 亲核性，将核心材料和适量的氨基丙基三烷氧基硅烷（APS）作为胶凝剂加入到溶液中，并将所得溶液乳化并分散到具有极性与芯材料极性相反的溶液中以通过涂覆芯材料进行微胶囊化 与硅胶壳通过溶胶 - 凝胶反应。 与使用氨溶液等碱性胶凝剂的常规方法相比，本发明的制备微胶囊的方法减少了环境污染，并且适用于具有亲水性或亲油性的有机或无机芯材。

公开(公告)号：US20030078443A1

公开(公告)日：2003-04-24

申请号：US10118094

申请日：2002-04-09

Applicant: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY

Inventor： Changjin Lee ,  Yongku Kang ,  Jong Goo Kang ,  Hee Jung Kim ,  Moon Young Jin ,  Sang Il Seok ,  Kookheon Char ,  Sang-Hyun Chu

IPC: C07F007/04 ,  C07C049/163

CPC classification number: C09D183/04 ,  C08G65/3311 ,  C08G65/3322 ,  C08G65/337 ,  C08G83/003 ,  C08J9/26 ,  C08J2201/046 ,  C08J2379/08 ,  C08J2383/04 ,  H01B3/18 ,  H01B3/46

Abstract: The present invention relates to polyalkylene oxide porogens having hyper-branches and low dielectric-constant insulators using them. More particularly, the present invention relates to polyalkylene oxide porogens having hyper-branches expressed by the following formula (1), where the polyalkylene oxide porogen has a center molecular (D) having branches (W), and low dielectric-constant insulators having nanopores prepared by coating a mixture of the porogen and a high heat-resistant resin such as polysilsesquioxane and thermal treating the coated substrate at a temperature effective to degrade the porogen. Dnull(nullYnullW)l nullnull(1)

Abstract translation: 本发明涉及具有超分支和使用它们的低介电常数绝缘体的聚环氧烷致孔剂。 更具体地说，本发明涉及具有由下式（1）表示的超分支的聚环氧烷致孔剂，其中聚环氧烷致孔剂具有分枝（W）的中心分子（D）和具有纳米孔的低介电常数绝缘体 通过涂覆致孔剂和高耐热树脂如聚倍半硅氧烷的混合物并在有效降解致孔剂的温度下热处理涂覆的基材来制备。 D - （ - Y-W）l（1）