公开(公告)号：US20220263381A1

公开(公告)日：2022-08-18

申请号：US17630722

申请日：2020-03-26

Applicant: KYB CORPORATION

Inventor： Shun Matsuda ,  Haruki Tomita ,  Hirotaka Tsukada

IPC: H02K5/22 ,  H02K9/22

Abstract: In the rotary electric machine, the circuit board is divided into a first substrate portion fixed to the heat sink and a second substrate portion to which one end of first to third terminals are soldered, in the first direction. Here, the heat sink is formed with first and second recesses and a step portion separated upward from the second substrate portion, and displacement of the second substrate portion in the plate thickness direction is allowed. Thus, in the event that the first to third terminals are displaced vertically with respect to the circuit board when the environmental temperature of the rotary electric machine 10 changes, since the second substrate portion is displaced in the vertical direction following the first to third terminals, the stress generated in the soldered portion between the first to third terminals and the second substrate portion can be relaxed for enhanced reliability.