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Patent Agency Ranking
公开(公告)号：US12003168B2
公开(公告)日：2024-06-04
申请号：US17615731
申请日：2020-03-26
Applicant: KYB CORPORATION
Inventor： Yuu Eguchi , Haruki Tomita , Shun Matsuda
Abstract: Increase the heat dissipation effect of the heat sink on the heat generating element.
In the rotary electric machine, the portions of the circuit board that are installed in the first and the second installation portion of the heat-sink are configured as non-coated portions, and the non-coated portion is not coated with resist. Therefore, the circuit board can be installed in the first and the second installation portion of the heat-sink without being affected by the variation in the film thickness of the resist. Thus, the gap between the FET mounted on the circuit board and the first to third heat dissipating portion of the heat-sink can be set as small as possible. Therefore, the heat generated by the FET can be efficiently transferred to the heat-sink. As described above, the heat dissipation effect of the heat-sink on the FET can be enhanced.-
公开(公告)号：US12003148B2
公开(公告)日：2024-06-04
申请号：US17614090
申请日：2020-03-26
Applicant: KYB CORPORATION
Inventor： Haruki Tomita , Yuu Eguchi
CPC classification number: H02K11/33 , H02K5/18 , H02K5/225 , H02K9/227 , H02K2203/09
Abstract: Improving the assemblability while improving the heat dissipation effect of the heat-sink.
In the rotary electric machine, the ECU unit has the heat-sink that closes the opening of the housing of the motor portion, the circuit board fixed to the lower side of the heat-sink, and the connector assembly fixed to the upper side of the heat-sink with a part of the heat-sink exposed. Thus, the heat of the electronic components of the circuit board can be dissipated to the outside of the rotary electric machine by the heat-sink. Moreover, a connection terminal is provided on the lower surface of the circuit board, and the bus bar terminal portion of the motor portion is press-fitted into the connection terminal. Therefore, the bus bar terminal portion can be connected to the circuit board without being soldered to the circuit board. Therefore, the assemblability of the rotary electric machine can be improved.-
公开(公告)号：US20220224208A1
公开(公告)日：2022-07-14
申请号：US17614090
申请日：2020-03-26
Applicant: KYB CORPORATION
Inventor： Haruki Tomita , Yuu Eguchi
Abstract: Improving the assemblability while improving the heat dissipation effect of the heat-sink.
In the rotary electric machine, the ECU unit has the heat-sink that closes the opening of the housing of the motor portion, the circuit board fixed to the lower side of the heat-sink, and the connector assembly fixed to the upper side of the heat-sink with a part of the heat-sink exposed. Thus, the heat of the electronic components of the circuit board can be dissipated to the outside of the rotary electric machine by the heat-sink. Moreover, a connection terminal is provided on the lower surface of the circuit board, and the bus bar terminal portion of the motor portion is press-fitted into the connection terminal. Therefore, the bus bar terminal portion can be connected to the circuit board without being soldered to the circuit board. Therefore, the assemblability of the rotary electric machine can be improved.-
公开(公告)号：US20220263381A1
公开(公告)日：2022-08-18
申请号：US17630722
申请日：2020-03-26
Applicant: KYB CORPORATION
Inventor： Shun Matsuda , Haruki Tomita , Hirotaka Tsukada
Abstract: In the rotary electric machine, the circuit board is divided into a first substrate portion fixed to the heat sink and a second substrate portion to which one end of first to third terminals are soldered, in the first direction. Here, the heat sink is formed with first and second recesses and a step portion separated upward from the second substrate portion, and displacement of the second substrate portion in the plate thickness direction is allowed. Thus, in the event that the first to third terminals are displaced vertically with respect to the circuit board when the environmental temperature of the rotary electric machine 10 changes, since the second substrate portion is displaced in the vertical direction following the first to third terminals, the stress generated in the soldered portion between the first to third terminals and the second substrate portion can be relaxed for enhanced reliability.
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公开(公告)号：US20220247275A1
公开(公告)日：2022-08-04
申请号：US17615731
申请日：2020-03-26
Applicant: KYB CORPORATION
Inventor： Yuu Eguchi , Haruki Tomita , Shun Matsuda
Abstract: Increase the heat dissipation effect of the heat sink on the heat generating element.
In the rotary electric machine, the portions of the circuit board that are installed in the first and the second installation portion of the heat-sink are configured as non-coated portions, and the non-coated portion is not coated with resist. Therefore, the circuit board can be installed in the first and the second installation portion of the heat-sink without being affected by the variation in the film thickness of the resist. Thus, the gap between the FET mounted on the circuit board and the first to third heat dissipating portion of the heat-sink can be set as small as possible. Therefore, the heat generated by the FET can be efficiently transferred to the heat-sink. As described above, the heat dissipation effect of the heat-sink on the FET can be enhanced.
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