公开(公告)号：US20240395656A1

公开(公告)日：2024-11-28

申请号：US18650179

申请日：2024-04-30

Applicant: KYOCERA AVX Components Corporation

Inventor： Cory Nelson ,  Shelby Bartley ,  Thomas Delvaux

IPC: H01L23/367 ,  H01L21/3213 ,  H01L21/768 ,  H01L23/373

Abstract: A component assembly can include an electrical component disposed on a heat sink component to mechanically stabilize the electrical component such that the electrical component may be relatively thin. For example, the heat sink component can include a heat sink substrate comprising a thermally conductive material that is electrically non-conductive. The heat sink substrate can have a first surface and a second surface opposite the first surface, with an electrically conductive layer formed over the second surface of the heat sink substrate. The electrical component can include a component substrate having a first surface and a second surface opposite the first surface, and an electrically conductive pattern can be formed over the first surface of the component substrate. The second surface of the component substrate can be disposed adjacent the first surface of the heat sink substrate.