公开(公告)号：US20230368985A1

公开(公告)日：2023-11-16

申请号：US18352406

申请日：2023-07-14

Applicant: KYOCERA AVX Components Corporation

Inventor： Shelby Bartley ,  Jeffrey Cain ,  Joseph M. Hock

IPC: H01G11/82 ,  H01G11/14 ,  H01G11/10

CPC classification number: H01G11/82 ,  H01G11/14 ,  H01G11/10

Abstract: An ultracapacitor module is disclosed. The ultracapacitor module comprises: an enclosure, and a plurality of ultracapacitors housed within the enclosure wherein at least one ultracapacitor of the plurality of ultracapacitors is secured to the enclosure. The ultracapacitor module satisfies one or more of the following conditions upon being subjected to a vibration profile in accordance with ISO 16750-3-2012, Table 12 and IEC 60068-2-64: a capacitance within a rated capacitance value as determined in accordance IEC 62391-1, Method 1A, an equivalent series resistance within a rated equivalent series resistance value as determined in accordance IEC 62391-1, a leakage current within a rated leakage current value as determined in accordance IEC 62391-1, an operating voltage with a rated operating voltage value.

公开(公告)号：US20230026454A1

公开(公告)日：2023-01-26

申请号：US17856086

申请日：2022-07-01

Applicant: KYOCERA AVX Components Corporation

Inventor： Jeffrey Cain ,  Joseph N. Hock ,  Shelby Bartley

IPC: H02J7/34 ,  G06F1/26 ,  H02M3/158

Abstract: A data center rack is disclosed. The data center rack comprises a plurality of chamber openings including computing devices; and at least one chamber opening including a mounted ultracapacitor module comprising a plurality of ultracapacitors. A data center comprising a data center rack is also disclosed.

公开(公告)号：US11742156B2

公开(公告)日：2023-08-29

申请号：US17510636

申请日：2021-10-26

Applicant: KYOCERA AVX Components Corporation

Inventor： Shelby Bartley ,  Jeffrey Cain ,  Joseph M. Hock

IPC: H01G11/82 ,  H01G11/10 ,  H01G11/14

CPC classification number: H01G11/82 ,  H01G11/10 ,  H01G11/14

Abstract: An ultracapacitor module is disclosed. The ultracapacitor module comprises: an enclosure, and a plurality of ultracapacitors housed within the enclosure wherein at least one ultracapacitor of the plurality of ultracapacitors is secured to the enclosure. The ultracapacitor module satisfies one or more of the following conditions upon being subjected to a vibration profile in accordance with ISO 16750-3-2012, Table 12 and IEC 60068-2-64: a capacitance within a rated capacitance value as determined in accordance IEC 62391-1, Method 1A, an equivalent series resistance within a rated equivalent series resistance value as determined in accordance IEC 62391-1, a leakage current within a rated leakage current value as determined in accordance IEC 62391-1, an operating voltage with a rated operating voltage value.

公开(公告)号：US20220130622A1

公开(公告)日：2022-04-28

申请号：US17510636

申请日：2021-10-26

Applicant: KYOCERA AVX Components Corporation

Inventor： Shelby Bartley ,  Jeffrey Cain ,  Joseph M. Hock

IPC: H01G11/82 ,  H01G11/14 ,  H01G11/10

Abstract: An ultracapacitor module is disclosed. The ultracapacitor module comprises: an enclosure, and a plurality of ultracapacitors housed within the enclosure wherein at least one ultracapacitor of the plurality of ultracapacitors is secured to the enclosure. The ultracapacitor module satisfies one or more of the following conditions upon being subjected to a vibration profile in accordance with ISO 16750-3-2012, Table 12 and IEC 60068-2-64: a capacitance within a rated capacitance value as determined in accordance IEC 62391-1, Method 1A, an equivalent series resistance within a rated equivalent series resistance value as determined in accordance IEC 62391-1, a leakage current within a rated leakage current value as determined in accordance IEC 62391-1, an operating voltage with a rated operating voltage value.

公开(公告)号：US20240395656A1

公开(公告)日：2024-11-28

申请号：US18650179

申请日：2024-04-30

Applicant: KYOCERA AVX Components Corporation

Inventor： Cory Nelson ,  Shelby Bartley ,  Thomas Delvaux

IPC: H01L23/367 ,  H01L21/3213 ,  H01L21/768 ,  H01L23/373

Abstract: A component assembly can include an electrical component disposed on a heat sink component to mechanically stabilize the electrical component such that the electrical component may be relatively thin. For example, the heat sink component can include a heat sink substrate comprising a thermally conductive material that is electrically non-conductive. The heat sink substrate can have a first surface and a second surface opposite the first surface, with an electrically conductive layer formed over the second surface of the heat sink substrate. The electrical component can include a component substrate having a first surface and a second surface opposite the first surface, and an electrically conductive pattern can be formed over the first surface of the component substrate. The second surface of the component substrate can be disposed adjacent the first surface of the heat sink substrate.