公开(公告)号：US20230198229A1

公开(公告)日：2023-06-22

申请号：US17698258

申请日：2022-03-18

Applicant: KYOCERA SLD Laser, Inc.

Inventor： Troy Trottier ,  Sudeep Khanal

IPC: H01S5/323 ,  H01S5/125

CPC classification number: H01S5/32341 ,  H01S5/125

Abstract: A light source includes a laser diode device and a wavelength conversion member. The wavelength conversion member includes a wavelength conversion element having voids and a dielectric element. The dielectric element fills the voids on a surface of the wavelength conversion element adjacent to the dielectric element. An output facet of the laser diode device is configured to output a laser beam of electromagnetic radiation. The laser beam is incident on a surface of the wavelength conversion member and a light is emitted from the wavelength conversion member. The light emission includes a mixture of wavelengths characterized by at least the second wavelength from the wavelength conversion member.

公开(公告)号：US20230238767A1

公开(公告)日：2023-07-27

申请号：US18129615

申请日：2023-03-31

Applicant: KYOCERA SLD Laser, Inc.

Inventor： Sten Heikman ,  Terry Towe ,  Sudeep Khanal

IPC: H01S5/00 ,  H01S5/32 ,  H01S5/22 ,  H01S5/343 ,  H01S5/02224 ,  H01S5/024 ,  H01S5/02257 ,  H01S5/02325

CPC classification number: H01S5/0087 ,  H01S5/32 ,  H01S5/2201 ,  H01S5/3203 ,  H01S5/34333 ,  H01S5/02224 ,  H01S5/02469 ,  H01S5/02476 ,  H01S5/02257 ,  H01S5/02325 ,  F21V29/70

Abstract: A laser-based light source includes a material arranged on a package base adjacent to a laser diode chip and an optical element coupled to the material. The optical element is aligned to receive electromagnetic radiation from the laser diode chip. The optical element includes a wavelength conversion material and is configured to receive at least a portion of the electromagnetic radiation emitted by the laser diode chip. A reflective material surrounds sides of the optical element.