公开(公告)号：US09733142B2

公开(公告)日：2017-08-15

申请号：US14436280

申请日：2013-10-15

Applicant: KABUSHIKI KAISHA SAGINOMIYA SEISAKUSHO ,  FUJI ELECTRIC CO., LTD.

Inventor： Takuro Ishikawa ,  Yuji Kanai ,  Kazuhiro Matsunami

IPC: G01L19/06 ,  G01L9/00 ,  G01L19/14

CPC classification number: G01L19/069 ,  G01L9/0054 ,  G01L19/0645 ,  G01L19/142 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/00

Abstract: When a main body of a sensor chip (1) is in a grounded state, a shield layer (71) constituting a shield electrode formed on a circuit layer (72) is grounded through a resistor (46).

公开(公告)号：US10352808B2

公开(公告)日：2019-07-16

申请号：US14765890

申请日：2013-12-12

Applicant: Kabushiki Kaisha Saginomiya Seisakusho

Inventor： Takuro Ishikawa ,  Kazuya Takimoto ,  Kazunori Ishibashi ,  Hideaki Koga ,  Takahiro Kobayashi

IPC: G01L9/00 ,  G01L19/06 ,  G01L19/14

Abstract: Provided is a pressure detection unit in which a waterproof property can be improved. In a pressure sensor, a sealing-resin portion is joined to an outside side surface of an element main body made of stainless steel, aluminum, or nickel such that the sealing-resin portion surrounds a plurality of lead pins. In the pressure sensor, a roughened annular surface portion is provided at a region where the sealing-resin portion is joined on an upper end surface of the element main body so as to be disposed in a manner to partition an external peripheral edge and an internal peripheral edge arranged at the outside side surface of an element main body in the sealing-resin portion.

公开(公告)号：US10118244B2

公开(公告)日：2018-11-06

申请号：US14441039

申请日：2013-09-06

Applicant: Kabushiki Kaisha Saginomiya Seisakusho

Inventor： Yoshihiro Hamabe ,  Takuro Ishikawa

IPC: B23K11/14 ,  G01L19/00 ,  G01L19/06 ,  F16L41/08 ,  B23K101/06 ,  B23K103/04 ,  B23K103/22

Abstract: In a refrigerant circuit component or valve device, the present invention projection-welds a connector to a cap member and prevents intrusion of spatter into a refrigerant circuit. A-cylinder section in which an inside hole of the connector is open is inserted in an inside hole formed in the center of the cap member. The area between the A-cylinder section and a projection of the connector is used as a spatter generation space. The projection of the connector abuts against the cap member and is projection-welded to form a welded part. The open end of the inside hole of the A-cylinder section is crimped to pressure-join the open end to the open end of the inside hole of the cap member. Spatter is sealed inside the spatter generation space. A portion of the surface layer to which the generated spatter adheres may be removed by machining to provide a spatter-removed structure.

公开(公告)号：US20150292652A1

公开(公告)日：2015-10-15

申请号：US14441039

申请日：2013-09-06

Applicant: Kabushiki Kaisha Saginomiya Seisakusho

Inventor： Yoshihiro Hamabe ,  Takuro Ishikawa

IPC: F16L13/02 ,  B23K11/14

CPC classification number: B23K11/14 ,  B23K2101/06 ,  B23K2103/05 ,  B23K2103/22 ,  F16L41/082 ,  F16L41/084 ,  G01L19/003 ,  G01L19/0627

Abstract: In a refrigerant circuit component or valve device, the present invention projection-welds a connector to a cap member and prevents intrusion of spatter into a refrigerant circuit. A-cylinder section in which an inside hole of the connector is open is inserted in an inside hole formed in the center of the cap member. The area between the A-cylinder section and a projection of the connector is used as a spatter generation space. The projection of the connector abuts against the cap member and is projection-welded to form a welded part. The open end of the inside hole of the A-cylinder section is crimped to pressure-join the open end to the open end of the inside hole of the cap member. Spatter is sealed inside the spatter generation space. A portion of the surface layer to which the generated spatter adheres may be removed by machining to provide a spatter-removed structure.

Abstract translation: 在制冷剂回路部件或阀装置中，本发明将连接器投射焊接到盖部件上，并防止飞溅物进入制冷剂回路。 连接器的内孔打开的A缸部插入形成在盖构件的中心的内孔中。 A缸部分和连接器的突起之间的区域用作飞溅产生空间。 连接器的突起抵靠盖构件，并且被投影焊接以形成焊接部分。 A缸部分的内孔的开口端被压接以将开口端压接到盖构件的内孔的开口端。 飞溅物密封在飞溅发生的空间内。 生成的飞溅物附着的表面层的一部分可以通过机械加工去除以提供飞溅去除的结构。

公开(公告)号：US20150285703A1

公开(公告)日：2015-10-08

申请号：US14436280

申请日：2013-10-15

Applicant: KABUSHIKI KAISHA SAGINOMIYA SEISAKUSHO ,  FUJI ELECTRIC CO., LTD.

Inventor： Takuro Ishikawa ,  Yuji Kanai ,  Kazuhiro Matsunami

IPC: G01L19/06

CPC classification number: G01L19/069 ,  G01L9/0054 ,  G01L19/0645 ,  G01L19/142 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/00

Abstract: When a main body of a sensor chip (1) is in a grounded state, a shield layer (71) constituting a shield electrode formed on a circuit layer (72) is grounded through a resistor (46).

Abstract translation: 当传感器芯片（1）的主体处于接地状态时，形成在电路层（72）上的构成屏蔽电极的屏蔽层（71）通过电阻（46）接地。