-
公开(公告)号：US08039910B2
公开(公告)日：2011-10-18
申请号：US11964995
申请日：2007-12-27
申请人： Kai-Hsiang Yen , Jen-Yi Chen , Po-Hsun Sung
发明人： Kai-Hsiang Yen , Jen-Yi Chen , Po-Hsun Sung
IPC分类号： H01L29/84
CPC分类号： B81C1/0023 , B81B2201/0257 , B81B2207/012 , H01L2224/48091 , H01L2224/48137 , H01L2924/10253 , H01L2924/1461 , H01L2924/3025 , H04R19/005 , H04R31/00 , H01L2924/00014 , H01L2924/00
摘要： An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transuding and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.
摘要翻译： 提供了包括感测芯片，载体芯片和密封元件的电声感测装置。 感测芯片用于电声输出，从而输出电信号。 布置在感测芯片下方的载体芯片具有至少一个第二连接点，至少一个电通道和至少一个通道连接点。 第二连接点与第一连接点电接触。 第二连接点和通道连接点位于载体芯片的不同表面。 电气通道穿过载体芯片并电连接第二连接点和通道连接点。 电信号通过第一和第二连接点和电通道传输到通道连接点。 密封元件设置在感测芯片和载体芯片之间，用于气密地耦合两个芯片。
-
公开(公告)号：US08035402B2
公开(公告)日：2011-10-11
申请号：US13017052
申请日：2011-01-31
申请人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
发明人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
CPC分类号： G01L9/0073
摘要： A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.
摘要翻译： 提供了包括载体，多个导电凸块，通过导电凸块连接到载体的电容感测元件和盖的传感器。 电容感测元件具有膜，并且在电容感测元件，导电凸块和载体之间形成通道。 盖子设置在载体上以覆盖电容式感测元件。 在电容式感测元件和盖子之间形成一个室。 腔室和通道分别位于膜的两侧。
-
公开(公告)号：US20110121843A1
公开(公告)日：2011-05-26
申请号：US13017052
申请日：2011-01-31
申请人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
发明人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
CPC分类号： G01L9/0073
摘要： A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.
摘要翻译： 提供了包括载体，多个导电凸块，通过导电凸块连接到载体的电容感测元件和盖的传感器。 电容感测元件具有膜，并且在电容感测元件，导电凸块和载体之间形成通道。 盖子设置在载体上以覆盖电容式感测元件。 在电容式感测元件和盖子之间形成一个室。 腔室和通道分别位于膜的两侧。
-
公开(公告)号：US07902843B2
公开(公告)日：2011-03-08
申请号：US12110369
申请日：2008-04-28
申请人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
发明人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
CPC分类号： G01L9/0073
摘要： A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.
摘要翻译： 包括具有两个通道的载体的传感器，设置在载体上的电容式感测元件和盖。 电容式感测元件具有膜，并且在膜和载体之间形成第一室。 盖子设置在载体上以覆盖电容式感测元件。 在膜和盖之间形成第二室。 第一室和第二室位于膜的两侧，并且通道分别与第一室和第二室连通。
-
公开(公告)号：US20090115430A1
公开(公告)日：2009-05-07
申请号：US12110369
申请日：2008-04-28
申请人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
发明人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
CPC分类号： G01L9/0073
摘要： A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.
摘要翻译： 包括具有两个通道的载体的传感器，设置在载体上的电容式感测元件和盖。 电容式感测元件具有膜，并且在膜和载体之间形成第一室。 盖子设置在载体上以覆盖电容式感测元件。 在膜和盖之间形成第二室。 第一室和第二室位于膜的两侧，并且通道分别与第一室和第二室连通。
-
公开(公告)号：US20090101998A1
公开(公告)日：2009-04-23
申请号：US11964995
申请日：2007-12-27
申请人： Kai-Hsiang Yen , Jen-Yi Chen , Po-Hsun Sung
发明人： Kai-Hsiang Yen , Jen-Yi Chen , Po-Hsun Sung
CPC分类号： B81C1/0023 , B81B2201/0257 , B81B2207/012 , H01L2224/48091 , H01L2224/48137 , H01L2924/10253 , H01L2924/1461 , H01L2924/3025 , H04R19/005 , H04R31/00 , H01L2924/00014 , H01L2924/00
摘要： An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transducing and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.
摘要翻译： 提供了包括感测芯片，载体芯片和密封元件的电声感测装置。 感测芯片用于电声转换，从而输出电信号。 布置在感测芯片下方的载体芯片具有至少一个第二连接点，至少一个电通道和至少一个通道连接点。 第二连接点与第一连接点电接触。 第二连接点和通道连接点位于载体芯片的不同表面。 电气通道穿过载体芯片并电连接第二连接点和通道连接点。 电信号通过第一和第二连接点和电通道传输到通道连接点。 密封元件设置在感测芯片和载体芯片之间，用于气密地耦合两个芯片。
-
公开(公告)号：US20060001114A1
公开(公告)日：2006-01-05
申请号：US10927066
申请日：2004-08-27
申请人： Jen-Yi Chen , Jing-Hung Chiou , Kai-Hsiang Yen
发明人： Jen-Yi Chen , Jing-Hung Chiou , Kai-Hsiang Yen
IPC分类号： H01L29/82
CPC分类号： B81C1/00301 , B81B2207/095 , B81C1/00896 , B81C2201/053 , H01L21/50 , H01L23/04 , H01L23/055 , H01L23/24 , H01L2224/05001 , H01L2224/05022 , H01L2224/16 , H01L2924/00014 , H01L2924/16235 , H01L2224/05599 , H01L2224/05099
摘要： An apparatus of wafer level package for the micro elements and methods of fabricating the same is disclosed. The apparatus is utilized to provide a lid substrate for bonding the lid substrate to a substrate having several micro elements and therefore form a cavity capable of being operated for the micro elements. The openings of the cavity are used to make the micro elements capable of being contacted with the atmosphere and therefore form an apparatus of wafer level package for the micro elements.
摘要翻译： 公开了一种用于微元件的晶片级封装的装置及其制造方法。 该装置用于提供用于将盖基板接合到具有几个微元件的基板的盖基板，因此形成能够对微元件进行操作的空腔。 空腔的开口用于使微元件能够与大气接触，并且因此形成用于微元件的晶片级封装的装置。
-
公开(公告)号：US08144899B2
公开(公告)日：2012-03-27
申请号：US12184191
申请日：2008-07-31
申请人： Po-Hsun Song , Jen-Yi Chen , Kai-Hsiang Yen
发明人： Po-Hsun Song , Jen-Yi Chen , Kai-Hsiang Yen
CPC分类号： H04R19/04
摘要： An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.
摘要翻译： 声换能器包括基底，被配置为相对于基底移动的膜，多个支撑件，其构造成将膜悬挂在基底上，从该膜延伸的第一组突起，以及从基底延伸的第二组突起 所述第二组突起相对于所述第一组突起交织并可移动，其中所述第一组突起和所述第二组突起中的一组的每个突起由第一导电层，第二导电层和 第一导电层和第二导电层之间的介电层，第一组突起的另一组和第二组突起的每个突起由第三导电层组成。
-
公开(公告)号：US20070154040A1
公开(公告)日：2007-07-05
申请号：US11541632
申请日：2006-10-03
申请人： Jen-Yi Chen
发明人： Jen-Yi Chen
IPC分类号： H04R25/00
CPC分类号： H04R19/04 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要： A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.
摘要翻译： 提供一种电容麦克风及其制造方法。 在具有至少一个空腔的基板上形成具有多个孔的背板，并且在背板上形成隔膜。 背板和隔膜之间有气隙。 气隙和空腔通过每个孔相互连通。 隔膜和背板分隔第一距离和小于第一距离的第二距离，使得差异形成在隔膜上。 第二距离区域通过由雾或其他流体产生的表面粘性固定。
-
公开(公告)号：US07912235B2
公开(公告)日：2011-03-22
申请号：US11541632
申请日：2006-10-03
申请人： Jen-Yi Chen
发明人： Jen-Yi Chen
IPC分类号： H04R25/00
CPC分类号： H04R19/04 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要： A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.
摘要翻译： 提供一种电容麦克风及其制造方法。 在具有至少一个空腔的基板上形成具有多个孔的背板，并且在背板上形成隔膜。 背板和隔膜之间有气隙。 气隙和空腔通过每个孔相互连通。 隔膜和背板分隔第一距离和小于第一距离的第二距离，使得差异形成在隔膜上。 第二距离区域通过由雾或其他流体产生的表面粘性固定。
-
-
-
-
-
-
-
-
-
搜索结果
18 条记录 (耗时 0.017 秒)
