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1.发明申请公开(公告)号：US20130323859A1
公开(公告)日：2013-12-05
申请号：US13486270
申请日：2012-06-01
申请人： Kun-Ei CHEN , Jen-Yi CHEN , Yi-Chung LIN , Chen-Chieh CHIANG , Ling-Sung WANG
发明人： Kun-Ei CHEN , Jen-Yi CHEN , Yi-Chung LIN , Chen-Chieh CHIANG , Ling-Sung WANG
CPC分类号： C23C16/52 , C23C16/14 , C23C16/45527 , H01J37/32981
摘要： A method of semiconductor processing comprises providing a semiconductor wafer in a processing chamber; feeding at least one tungsten-containing precursor in a gas state into the processing chamber for atomic layer deposition (ALD) of tungsten; feeding at least one reducing chemical in a gas state into the processing chamber; and monitoring a concentration of at least one gaseous byproduct in the chamber; and providing a signal indicating concentration of the at least one gaseous byproduct in the chamber. The byproduct is produced by a reaction between the at least one tungsten-containing precursor and the at least one reducing chemical during the ALD.
摘要翻译： 一种半导体处理方法包括在处理室中设置半导体晶片; 将至少一种以气体状态的含钨前体进料到用于钨的原子层沉积（ALD）的处理室中; 将至少一种气体状态的还原化学品进料到所述处理室中; 以及监测所述室中的至少一种气态副产物的浓度; 以及提供指示所述室中所述至少一种气态副产物的浓度的信号。 在ALD期间，副产物通过至少一种含钨前体与至少一种还原化学物质之间的反应产生。
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公开(公告)号：US20070154040A1
公开(公告)日：2007-07-05
申请号：US11541632
申请日：2006-10-03
申请人： Jen-Yi Chen
发明人： Jen-Yi Chen
IPC分类号： H04R25/00
CPC分类号： H04R19/04 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要： A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.
摘要翻译： 提供一种电容麦克风及其制造方法。 在具有至少一个空腔的基板上形成具有多个孔的背板，并且在背板上形成隔膜。 背板和隔膜之间有气隙。 气隙和空腔通过每个孔相互连通。 隔膜和背板分隔第一距离和小于第一距离的第二距离，使得差异形成在隔膜上。 第二距离区域通过由雾或其他流体产生的表面粘性固定。
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公开(公告)号：US07912235B2
公开(公告)日：2011-03-22
申请号：US11541632
申请日：2006-10-03
申请人： Jen-Yi Chen
发明人： Jen-Yi Chen
IPC分类号： H04R25/00
CPC分类号： H04R19/04 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要： A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.
摘要翻译： 提供一种电容麦克风及其制造方法。 在具有至少一个空腔的基板上形成具有多个孔的背板，并且在背板上形成隔膜。 背板和隔膜之间有气隙。 气隙和空腔通过每个孔相互连通。 隔膜和背板分隔第一距离和小于第一距离的第二距离，使得差异形成在隔膜上。 第二距离区域通过由雾或其他流体产生的表面粘性固定。
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公开(公告)号：US20090086999A1
公开(公告)日：2009-04-02
申请号：US12184191
申请日：2008-07-31
申请人： Po-Hsun SONG , Jen-Yi CHEN , Kai-Hsiang YEN
发明人： Po-Hsun SONG , Jen-Yi CHEN , Kai-Hsiang YEN
IPC分类号： H04R3/00
CPC分类号： H04R19/04
摘要： An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.
摘要翻译： 声换能器包括基底，被配置为相对于基底移动的膜，多个支撑件，其构造成将膜悬挂在基底上，从该膜延伸的第一组突起，以及从基底延伸的第二组突起 所述第二组突起相对于所述第一组突起交织并可移动，其中所述第一组突起和所述第二组突起中的一组的每个突起由第一导电层，第二导电层和 第一导电层和第二导电层之间的介电层，第一组突起的另一组和第二组突起的每个突起由第三导电层组成。
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公开(公告)号：US20060001114A1
公开(公告)日：2006-01-05
申请号：US10927066
申请日：2004-08-27
申请人： Jen-Yi Chen , Jing-Hung Chiou , Kai-Hsiang Yen
发明人： Jen-Yi Chen , Jing-Hung Chiou , Kai-Hsiang Yen
IPC分类号： H01L29/82
CPC分类号： B81C1/00301 , B81B2207/095 , B81C1/00896 , B81C2201/053 , H01L21/50 , H01L23/04 , H01L23/055 , H01L23/24 , H01L2224/05001 , H01L2224/05022 , H01L2224/16 , H01L2924/00014 , H01L2924/16235 , H01L2224/05599 , H01L2224/05099
摘要： An apparatus of wafer level package for the micro elements and methods of fabricating the same is disclosed. The apparatus is utilized to provide a lid substrate for bonding the lid substrate to a substrate having several micro elements and therefore form a cavity capable of being operated for the micro elements. The openings of the cavity are used to make the micro elements capable of being contacted with the atmosphere and therefore form an apparatus of wafer level package for the micro elements.
摘要翻译： 公开了一种用于微元件的晶片级封装的装置及其制造方法。 该装置用于提供用于将盖基板接合到具有几个微元件的基板的盖基板，因此形成能够对微元件进行操作的空腔。 空腔的开口用于使微元件能够与大气接触，并且因此形成用于微元件的晶片级封装的装置。
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6.发明授权公开(公告)号：US08695426B2
公开(公告)日：2014-04-15
申请号：US13220068
申请日：2011-08-29
申请人： Yu Wen Hsu , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
发明人： Yu Wen Hsu , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
IPC分类号： G01C19/56
CPC分类号： B81C1/00301 , B81B3/0086 , B81B2201/0242 , B81B2207/07 , B81C2203/0792 , G01C19/5762
摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
摘要翻译： 本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。 弹簧连接到锚固件和移动部件。 绝缘层设置在移动部分和锚中。 移动部分和锚固体中的每一个被绝缘层分成两个导电部分。 由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。
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7.发明申请公开(公告)号：US20120160027A1
公开(公告)日：2012-06-28
申请号：US13220068
申请日：2011-08-29
申请人： Yu Wen HSU , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
发明人： Yu Wen HSU , Shih Ting Lin , Jen Yi Chen , Chao Ta Huang
CPC分类号： B81C1/00301 , B81B3/0086 , B81B2201/0242 , B81B2207/07 , B81C2203/0792 , G01C19/5762
摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
摘要翻译： 本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。 弹簧连接到锚固件和移动部件。 绝缘层设置在移动部分和锚中。 移动部分和锚固体中的每一个被绝缘层分成两个导电部分。 由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。
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公开(公告)号：US08144899B2
公开(公告)日：2012-03-27
申请号：US12184191
申请日：2008-07-31
申请人： Po-Hsun Song , Jen-Yi Chen , Kai-Hsiang Yen
发明人： Po-Hsun Song , Jen-Yi Chen , Kai-Hsiang Yen
CPC分类号： H04R19/04
摘要： An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.
摘要翻译： 声换能器包括基底，被配置为相对于基底移动的膜，多个支撑件，其构造成将膜悬挂在基底上，从该膜延伸的第一组突起，以及从基底延伸的第二组突起 所述第二组突起相对于所述第一组突起交织并可移动，其中所述第一组突起和所述第二组突起中的一组的每个突起由第一导电层，第二导电层和 第一导电层和第二导电层之间的介电层，第一组突起的另一组和第二组突起的每个突起由第三导电层组成。
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公开(公告)号：US08035402B2
公开(公告)日：2011-10-11
申请号：US13017052
申请日：2011-01-31
申请人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
发明人： Yu-Jen Fang , Jen-Yi Chen , Kai-Hsiang Yen , Po-Hsun Sung
CPC分类号： G01L9/0073
摘要： A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.
摘要翻译： 提供了包括载体，多个导电凸块，通过导电凸块连接到载体的电容感测元件和盖的传感器。 电容感测元件具有膜，并且在电容感测元件，导电凸块和载体之间形成通道。 盖子设置在载体上以覆盖电容式感测元件。 在电容式感测元件和盖子之间形成一个室。 腔室和通道分别位于膜的两侧。
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10.发明授权MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall 有权具有悬浮微结构的MEMS结构，其包括由多个金属层夹持的电介质层和具有被外围金属壁包围的边缘的电介质层公开(公告)号：US07960805B2
公开(公告)日：2011-06-14
申请号：US12348322
申请日：2009-01-05
申请人： Jen-Yi Chen , Chin-Horng Wang
发明人： Jen-Yi Chen , Chin-Horng Wang
IPC分类号： H01L29/84
CPC分类号： B81C1/00476 , B81B2201/0257 , B81C1/00801 , B81C2201/014 , B81C2203/0714 , H04R19/005 , H04R19/04 , H04R31/00
摘要： An MEMS structure and a method of manufacturing the same are provided. The MEMS structure includes a substrate and at least one suspended microstructure located on the substrate. The suspended microstructure includes a plurality of metal layers, at least one dielectric layer, and at least one peripheral metal wall. The dielectric layer is sandwiched by the metal layers, and the peripheral metal wall is parallel to a thickness direction of the suspended microstructure and surrounds an edge of the dielectric layer.
摘要翻译： 提供了MEMS结构及其制造方法。 MEMS结构包括衬底和位于衬底上的至少一个悬浮微结构。 悬浮的微结构包括多个金属层，至少一个电介质层和至少一个外围金属壁。 电介质层被金属层夹在中间，周边金属壁平行于悬浮微结构的厚度方向并且包围电介质层的边缘。
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