公开(公告)号：US4069498A

公开(公告)日：1978-01-17

申请号：US738783

申请日：1976-11-03

Applicant: Kailash Chandra Joshi

Inventor： Kailash Chandra Joshi

IPC: H01L23/34 ,  H01L23/12 ,  H01L23/367 ,  H01L23/433 ,  H01L23/02 ,  H01L39/02

CPC classification number: H01L23/4338 ,  H01L23/3677 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16151 ,  H01L2924/16152

Abstract: Heat is removed from the silicon devices in an integrated circuit package by means of a stud which is slidably mounted in a cap enclosing the integrated circuit device. A low melt solder is used to join the stud to the cap and the same solder is also deposited on the stud tip, which will subsequently contact the integrated circuit device in the package. After the integrated circuit, substrate and cap are assembled and sealed, the assembly is heated to melt the low melt solder so that the stud slides down and makes contact with the integrated circuit device. A controlled pressure can be applied to the stud if sliding does not occur. Thereafter, the assembly is allowed to cool. Upon cooling, a submicron gap exists between the solder on the tip of the stud and the device providing electrical isolation, but not significantly degrading the thermal path between the device and the ambient atmosphere.

Abstract translation: 借助于可滑动地安装在封闭集成电路装置的盖中的螺柱将热量从集成电路封装中的硅器件中去除。 使用低熔点焊料将螺柱连接到盖上，并且相同的焊料也沉积在螺柱尖端上，其随后将与封装中的集成电路器件接触。 在集成电路，基板和盖被组装和密封之后，加热组件以熔化低熔点焊料，使得螺柱向下滑动并与集成电路器件接触。 如果不发生滑动，则可以对螺柱施加受控的压力。 此后，使组件冷却。 在冷却时，在螺柱的尖端上的焊料和提供电隔离的装置之间存在亚微米间隙，但不会显着降低装置与环境大气之间的热路径。