公开(公告)号：US11942453B2

公开(公告)日：2024-03-26

申请号：US17401676

申请日：2021-08-13

申请人： KAMBIX INNOVATIONS, LLC

发明人： Kambiz Vafai ,  Andisheh Tavakoli ,  Mohammad Reza Salimpour

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L23/46

CPC分类号： H01L25/0657 ,  H01L23/3672 ,  H01L23/46 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589

摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

公开(公告)号：US20230048534A1

公开(公告)日：2023-02-16

申请号：US17401676

申请日：2021-08-13

申请人： KAMBIX INNOVATIONS, LLC

发明人： Kambiz Vafai ,  Andisheh Tavakoli ,  Mohammad Reza Salimpour

IPC分类号： H01L25/065 ,  H01L23/46 ,  H01L23/367

摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

公开(公告)号：US20240213221A1

公开(公告)日：2024-06-27

申请号：US18400219

申请日：2023-12-29

申请人： Kambix Innovations, LLC

发明人： Kambiz Vafai ,  Andisheh Tavakoli ,  Mohammad Reza Salimpour

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L23/46

CPC分类号： H01L25/0657 ,  H01L23/3672 ,  H01L23/46 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589

摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

公开(公告)号：US20230047658A1

公开(公告)日：2023-02-16

申请号：US17401719

申请日：2021-08-13

申请人： KAMBIX INNOVATIONS, LLC

发明人： Kambiz Vafai ,  Andisheh Tavakoli ,  Mohammad Reza Salimpour

IPC分类号： H01L25/065 ,  H01L23/367

摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

公开(公告)号：US20230395570A1

公开(公告)日：2023-12-07

申请号：US18205916

申请日：2023-06-05

申请人： Kambix Innovations, LLC

发明人： Kambiz Vafai ,  Andisheh Tavakoli ,  Mohammad Reza Salimpour

IPC分类号： H01L25/065 ,  H01L23/367

CPC分类号： H01L25/0657 ,  H01L23/3672 ,  H01L23/3675 ,  H01L2225/06589 ,  H01L2225/06541 ,  H01L2225/06513 ,  H01L2225/06517

摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.

公开(公告)号：US11710723B2

公开(公告)日：2023-07-25

申请号：US17401719

申请日：2021-08-13

申请人： KAMBIX INNOVATIONS, LLC

发明人： Kambiz Vafai ,  Andisheh Tavakoli ,  Mohammad Reza Salimpour

IPC分类号： H01L25/065 ,  H01L23/367

CPC分类号： H01L25/0657 ,  H01L23/3672 ,  H01L23/3675 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589

摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.