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公开(公告)号：US11942453B2
公开(公告)日：2024-03-26
申请号：US17401676
申请日：2021-08-13
IPC分类号： H01L25/065 , H01L23/367 , H01L23/46
CPC分类号： H01L25/0657 , H01L23/3672 , H01L23/46 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589
摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
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公开(公告)号：US20220370816A1
公开(公告)日：2022-11-24
申请号：US17340053
申请日：2021-06-06
发明人： Kambiz Vafai , Erfan Kosari
摘要： A method and system for noninvasively treating a neurodegenerative disorder, can involve determining characteristics indicative of physical attributes of a central nervous system, the characteristics including parameters for diminishing adverse impacts of a magnetothermal stimulation treatment for a neurodegenerative disorder with respect to the central nervous system, and applying as a part of the magnetothermal stimulation treatment and based on the characteristics of the physical attributes of the central nervous system, a magnetic field to the brain for a thermal stimulation of neuron cells within the brain.
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公开(公告)号：US20240213221A1
公开(公告)日：2024-06-27
申请号：US18400219
申请日：2023-12-29
IPC分类号： H01L25/065 , H01L23/367 , H01L23/46
CPC分类号： H01L25/0657 , H01L23/3672 , H01L23/46 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589
摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
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公开(公告)号：US20230282548A1
公开(公告)日：2023-09-07
申请号：US18111427
申请日：2023-02-17
发明人： Kambiz Vafai , Sainan Lu
IPC分类号： H01L23/427 , H01L25/065 , H01L23/00
CPC分类号： H01L23/427 , H01L25/0657 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2224/16145 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/73204 , H01L2924/1436 , H01L2924/14511
摘要： A three-dimensional integrated circuit device can include a group of die, a device layer and a thermal interface material formed above the substrate. A heat spreader can be located above the die, the device layer and the thermal interface material. The heat spreader can include a heat pipe comprising a rectangular-shaped heat pipe or disk-shaped heat pipe. A heat sink can be located above the heat spreader. The heat sink can include the heat pipe comprising the rectangular-shaped heat pipe or the disk-shaped heat pipe.
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公开(公告)号：US20230047658A1
公开(公告)日：2023-02-16
申请号：US17401719
申请日：2021-08-13
IPC分类号： H01L25/065 , H01L23/367
摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
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公开(公告)号：US20220276010A1
公开(公告)日：2022-09-01
申请号：US17678571
申请日：2022-02-23
发明人： Kambiz Vafai , Ahmed Al-Sammarraie
摘要： A heat exchanger apparatus and a method of operating the heat exchanger apparatus include a convergent interface separating two counterflows, and at least two concentric conduits including an inner conduit and an outer conduit, wherein the outer conduit comprises an outer conduit radius that is maintained as invariant, and the inner conduit comprises an inner conduit radius that is adjustable to form the convergent interface separating the two counterflows, wherein heat transfer with respect to the two counterflows occurs at the convergent interface.
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公开(公告)号：US12087663B2
公开(公告)日：2024-09-10
申请号：US18214141
申请日：2023-06-26
发明人： Kambiz Vafai , Sainan Lu
IPC分类号： H01L23/467 , H01L25/065
CPC分类号： H01L23/467 , H01L25/0657
摘要： A three-dimensional integrated circuit apparatus includes a three-dimensional integrated circuit including a group of integrated double-layer microchannels (DLMC) and multi-layer microchannels (MLMC) with optimized thermal performance for the three-dimensional integrated circuit.
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公开(公告)号：US20240240832A1
公开(公告)日：2024-07-18
申请号：US18411007
申请日：2024-01-11
CPC分类号： F24S10/95 , F24S10/20 , F24S10/30 , F28D15/0233 , F28D15/04
摘要： A solar water heating system can be implemented utilizing an innovative flat-shaped heat pipe as a primary heat transfer device. The system can include two small insulated rectangular ducts at the top and a large insulated rectangular duct at the bottom of the flat-shaped heat pipe. An absorber, positioned to receive, collect, and transfer solar heat, can be integrated into the system, complemented by a glass cover to minimize heat loss. The flat-shaped heat pipe, which can be constructed from a copper plate with porous wicks on its inner surfaces, can be filled with a working fluid. Solar irradiation incident through the glass cover on the absorber triggers the evaporation of the working fluid, absorbing latent heat. Subsequently, the vapor moves and transfers evenly to both sides of the flat-shaped heat pipe, facilitating the transfer of heat to water flowing through the rectangular ducts situated outside the flat-shaped heat pipe. This configuration optimizes energy efficiency, offering a reliable and cost-effective solution for solar water heating applications.
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公开(公告)号：US20230048534A1
公开(公告)日：2023-02-16
申请号：US17401676
申请日：2021-08-13
IPC分类号： H01L25/065 , H01L23/46 , H01L23/367
摘要： A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
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10.发明申请METHODS AND SYSTEMS FOR ANALYZING DETECTION ENHANCEMENT OF MICROCANTILEVERS WITH LONG-SLIT BASED SENSORS 审中-公开用于分析基于长度传感器的微型计算机检测增强的方法和系统公开(公告)号：US20140180636A1
公开(公告)日：2014-06-26
申请号：US14042837
申请日：2013-10-01
IPC分类号： G01N33/543 , G01N19/00
CPC分类号： G01N33/54373 , G01N19/00
摘要： Methods and systems for analyzing the detection enhancement of rectangular microcantilevers with long-slit microsensors. The deflection profile of the microcantilevers can he compared with that of typical rectangular microcantilevers under presence of dynamic disturbances. Various force-loading conditions are considered. The theory of linear elasticity for thin beams is used to obtain the deflection related quantities. The disturbance in these quantities can be obtained based on wave propagation and beam vibration theories.
摘要翻译： 用长狭缝微传感器分析矩形微悬臂梁检测增强的方法和系统。 他可以在存在动力学干扰的情况下将微悬臂梁的偏转轮廓与典型的矩形微悬臂梁的偏转轮廓进行比较。 考虑各种力加载条件。 使用薄梁的线性弹性理论来获得偏转相关量。 这些量的扰动可以基于波传播和波束振动理论得到。
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