公开(公告)号：US20120267790A1

公开(公告)日：2012-10-25

申请号：US13196320

申请日：2011-08-02

Applicant: Kang-Seol LEE ,  Jae-Jin LEE ,  Jae-Hyuk IM

Inventor： Kang-Seol LEE ,  Jae-Jin LEE ,  Jae-Hyuk IM

IPC: H01L23/48

CPC classification number: H01L23/50 ,  H01L23/481 ,  H01L23/5286 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06527 ,  H01L2225/06544

Abstract: A semiconductor integrated circuit includes a semiconductor chip, a plurality of first through-chip vias formed vertically through the semiconductor chip and configured to operate as an interface for a first power supply, and a first common conductive layer provided over the semiconductor chip and coupling the plurality of first through-chip vias to each other in a horizontal direction.

Abstract translation: 半导体集成电路包括半导体芯片，垂直穿过半导体芯片形成并被配置为用作第一电源的接口的多个第一通孔通孔和设置在半导体芯片上的第一公共导电层， 多个第一通过芯片通孔在水平方向上彼此相对。