Integrated electromechanical arrangement and method of production
    2.
    发明授权
    Integrated electromechanical arrangement and method of production 有权
    综合机电布置和生产方法

    公开(公告)号:US07200009B2

    公开(公告)日:2007-04-03

    申请号:US10612397

    申请日:2003-07-01

    IPC分类号: H05K5/00

    摘要: It is an object of the invention to provide a electromechanical structure comprising an input device and a printed wired board (3, 4), which structure is advantageous in terms of manufacturing and offers freedom to the layout design of the printed wired board, the user interface as well as the appearance of the device itself. It is also an object of the invention to provide a electromechanical structure that is compact and facilitates the customizability and upgradability with a new electronic functionality without any need for modifications to the main electronics of the device. This is achieved by integrating the electromechanical assembly with the mechanical cover part of the electronic device by using an injection moulding process to compose an integrated combination (113) which is detachable from the electronic device. More precisely the objects of the invention are achieved by combining the injection mould technologies with the printing of electronic wired boards.

    摘要翻译: 本发明的目的是提供一种机电结构,其包括输入装置和印刷的布线板(3,4),该结构在制造方面是有利的,并且提供对印刷的有线板的布局设计的自由度,用户 接口以及设备本身的外观。 本发明的另一个目的是提供一种紧凑的机电结构,并利用新的电子功能便于定制和升级,而无需修改设备的主电子设备。 这通过使用注射成型工艺将机电组件与电子装置的机械盖部件集成来构成可从电子装置拆卸的集成组合(113)来实现。 更准确地说,本发明的目的是通过将注射模具技术与电子布线板的印刷结合来实现的。