公开(公告)号：US12129990B2

公开(公告)日：2024-10-29

申请号：US18050366

申请日：2022-10-27

申请人： Korrus, Inc.

发明人： Ariel Meir ,  Noam Meir ,  Rina Meir

IPC分类号： F21V5/08 ,  F21K9/68 ,  F21K9/69 ,  F21S8/04 ,  F21V7/00 ,  F21V7/04 ,  F21V7/28 ,  F21V17/04 ,  F21V31/04 ,  G02B19/00 ,  G02B27/30 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  F21S8/00 ,  F21V13/04 ,  F21W131/10 ,  F21Y103/10 ,  F21Y115/10

CPC分类号： F21V17/04 ,  F21K9/68 ,  F21K9/69 ,  F21S8/04 ,  F21V5/08 ,  F21V7/0091 ,  F21V7/041 ,  F21V7/28 ,  F21V31/04 ,  G02B19/0061 ,  G02B27/30 ,  H01L33/502 ,  H01L33/58 ,  H01L33/60 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/284 ,  F21S8/033 ,  F21V13/04 ,  F21W2131/10 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2933/0091 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2203/1316 ,  H05K2203/1327

摘要： According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, an LED mounted to the circuit board that is configured to emit light with an angular CCT deviation, a lens assembly mounted to the circuit board over the LED and configured to receive the light emitted from the LED and reduce the angular CCT deviation of the light received from the LED to make a color temperature of the light received from the LED more uniform, and an elastomer encapsulating at least part of the circuit board that is separate and distinct from the lens assembly.

公开(公告)号：US12089349B2

公开(公告)日：2024-09-10

申请号：US18239723

申请日：2023-08-29

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Ming-Hung Chen ,  Yung I Yeh ,  Chang-Lin Yeh ,  Sheng-Yu Chen

IPC分类号： H01L23/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K5/00 ,  H05K5/06 ,  H05K9/00

CPC分类号： H05K5/0017 ,  H05K1/142 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H05K2201/041 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

摘要： A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US12058809B2

公开(公告)日：2024-08-06

申请号：US17654350

申请日：2022-03-10

申请人： Vitesco Technologies Germany GMBH

发明人： Christian Walda ,  Johannes Brunner ,  Johannes Bock ,  Karin Beart ,  Jens Heinrich

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC分类号： H05K1/0268 ,  H05K1/181 ,  H05K3/28 ,  H05K2203/1327

摘要： A control unit for a motor vehicle is provided. The control unit includes a printed circuit board having a first side and an edge. The first side is delimited by the edge. At least one electronic component is arranged on the first side of the printed circuit board and is electrically conductively connected to the printed circuit board. At least one first conductor loop is arranged on the first side of the printed circuit board and at least one second conductor loop is arranged at a distance from the first conductor loop. The first conductor loop is arranged between the edge and the second conductor loop, and the second conductor loop is arranged between the first conductor loop and the at least one electronic component. An encapsulation surrounds at least the first side, the at least one electronic component, the first conductor loop and the second conductor loop.

公开(公告)号：US11934004B2

公开(公告)日：2024-03-19

申请号：US17674894

申请日：2022-02-18

申请人： TACTOTEK OY

发明人： Antti Keränen ,  Mikko Heikkinen

IPC分类号： F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

CPC分类号： G02B6/0091 ,  G02B6/0021 ,  G02B6/0031 ,  G02B6/0051 ,  G02B6/0065 ,  G02B6/0093 ,  G02B6/0055 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/181 ,  H05K3/12 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

摘要： An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US11819341B2

公开(公告)日：2023-11-21

申请号：US18176379

申请日：2023-02-28

申请人： Force Impact Technologies, Inc.

发明人： Anthony M. Gonzales ,  Robert M. Merriman ,  Susan M. Merriman ,  Christopher T. Cooper

IPC分类号： A61B5/00 ,  A63B71/08 ,  B29C51/12 ,  B29C51/26 ,  B29C51/30 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  G06F3/01 ,  G06F3/16 ,  G01C17/02 ,  G01C19/00 ,  G01P15/00 ,  A61B5/11 ,  B29K23/00 ,  B29L31/52 ,  B29L31/00

CPC分类号： A61B5/682 ,  A61B5/1126 ,  A61B5/4064 ,  A61B5/742 ,  A61B5/7455 ,  A63B71/085 ,  B29C51/12 ,  B29C51/266 ,  B29C51/30 ,  G01C17/02 ,  G01C19/00 ,  G01P15/00 ,  G06F3/016 ,  G06F3/16 ,  H05K1/028 ,  H05K1/189 ,  H05K3/284 ,  A61B2503/10 ,  A61B2560/0214 ,  A61B2562/0219 ,  A63B2220/40 ,  A63B2220/53 ,  A63B2225/50 ,  B29K2023/083 ,  B29K2909/14 ,  B29L2031/52 ,  B29L2031/768 ,  H05K2201/09027 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2203/1322 ,  H05K2203/1327

摘要： A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

公开(公告)号：US20190215964A1

公开(公告)日：2019-07-11

申请号：US16327435

申请日：2016-09-27

申请人： Intel Corporation

发明人： Brian J. Long

IPC分类号： H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/36 ,  H05K3/28

CPC分类号： H05K1/186 ,  H01R12/721 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K1/181 ,  H05K1/185 ,  H05K3/284 ,  H05K3/34 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2203/0228 ,  H05K2203/107 ,  H05K2203/1316 ,  H05K2203/1327

摘要： Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.

公开(公告)号：US20190200683A1

公开(公告)日：2019-07-04

申请号：US16192912

申请日：2018-11-16

申请人： Wearable Technology Limited

发明人： Michael John Lynch

IPC分类号： A41D1/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/28 ,  H01R12/71 ,  H01R12/62 ,  H01R43/20 ,  H01R13/58 ,  H01R13/516 ,  A41D1/04 ,  A41D3/00

CPC分类号： A41D1/002 ,  A41D1/04 ,  A41D3/00 ,  H01B3/46 ,  H01B7/0846 ,  H01R12/62 ,  H01R12/716 ,  H01R13/516 ,  H01R13/5845 ,  H01R13/622 ,  H01R43/205 ,  H05K1/142 ,  H05K3/28 ,  H05K3/368 ,  H05K2201/10356 ,  H05K2201/209 ,  H05K2203/1327

摘要： An electrical connector having a detachable interface and a permanent interface is supported by connecting the permanent interface to a circuit-board. A first loom end (303) and a second loom end (305) are connected to the circuit board and an over-moulding (404) is applied to cover the permanent interface, the first loom end and the second loom end. The detachable interface is located through an orifice in an item of clothing (410) and the over-moulding is secured to an internal surface of an item of clothing by a first side flange (404) and a second side flange (405).

公开(公告)号：US20180183161A1

公开(公告)日：2018-06-28

申请号：US15821861

申请日：2017-11-24

申请人： FUJI ELECTRIC CO., LTD.

发明人： Shin SOYANO

IPC分类号： H01R12/58 ,  H05K1/14 ,  H01R4/70 ,  H01R43/20 ,  H01R43/18

CPC分类号： H01R12/585 ,  H01L23/49811 ,  H01L23/5383 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01R4/70 ,  H01R12/58 ,  H01R13/41 ,  H01R43/18 ,  H01R43/205 ,  H05K1/142 ,  H05K3/0014 ,  H05K3/28 ,  H05K3/4015 ,  H05K2201/09118 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10522 ,  H05K2203/1327

摘要： A semiconductor device is provided, in order to prevent tilt of a terminal pin in the semiconductor device with a printed board in which the terminal pin is pressed, the semiconductor device comprising a printed board, a plurality of pins pressed in the printed board, a resin block in which a plurality of through holes are formed, the plurality of pins respectively pressed in the plurality of through holes, and a resin case covering at least a part of the printed board and the resin block.

公开(公告)号：US09999132B2

公开(公告)日：2018-06-12

申请号：US15163045

申请日：2016-05-24

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC分类号： H05K1/18 ,  G06K19/077 ,  H01L25/00 ,  H05K1/16 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/46

CPC分类号： H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

摘要： An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US20180159499A1

公开(公告)日：2018-06-07

申请号：US15803699

申请日：2017-11-03

申请人： TAIYO YUDEN CO., LTD.

发明人： Hidetaro NAKAZAWA ,  Takashi MATSUDA

IPC分类号： H03H9/02 ,  H03H9/05 ,  H05K1/02 ,  H03H9/72

CPC分类号： H03H9/02834 ,  H03H9/02102 ,  H03H9/02535 ,  H03H9/0523 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1085 ,  H03H9/72 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0243 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2203/1327

摘要： An electronic component includes: a first substrate; a second substrate that includes a functional element formed on a lower surface of the second substrate, the second substrate being mounted on the first substrate so that the functional element faces an upper surface of the first substrate across an air gap; and an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate.