公开(公告)号：US4510179A

公开(公告)日：1985-04-09

申请号：US509594

申请日：1983-06-30

申请人： Katsuhiko Honjo ,  Hiromitsu Taki ,  Noriya Sato

发明人： Katsuhiko Honjo ,  Hiromitsu Taki ,  Noriya Sato

IPC分类号： H01G4/008 ,  H01L21/48 ,  H05K1/09 ,  C23C3/02

CPC分类号： H05K1/092 ,  H01G4/0085 ,  H01L21/4867

摘要： This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % and the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

摘要翻译： 本发明提供一种低价格且具有稳定特性的耐热隔离基板上的电极及其制造方法。 在基材上形成含有0.05〜40重量％的银成分为0.5〜100重量％的金属材料和有机载体的剩余重量％，并在250〜900℃的温度下加热 并且因此在基板上形成厚度为0.05至2微米的金属颗粒层，然后通过无电镀在其上形成厚度为0.1-20微米的镍和铜的电极。

公开(公告)号：US4559279A

公开(公告)日：1985-12-17

申请号：US697893

申请日：1985-02-01

申请人： Katsuhiko Honjo ,  Hiromitsu Taki ,  Noriya Sato

发明人： Katsuhiko Honjo ,  Hiromitsu Taki ,  Noriya Sato

IPC分类号： H01G4/008 ,  H01L21/48 ,  H05K1/09 ,  C23C3/02

CPC分类号： H05K1/092 ,  H01G4/0085 ,  H01L21/4867 ,  Y10T428/12611 ,  Y10T428/1275 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12882 ,  Y10T428/12896

摘要： This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

摘要翻译： 本发明提供一种低价格且具有稳定特性的耐热隔离基板上的电极及其制造方法。 在基材上形成含有0.05〜40重量％的含有银成分0.5〜100重量％的有机载体的剩余重量％的金属材料，并在250〜900℃的温度下加热 因此在基板上形成厚度为0.05至2微米的金属颗粒层，然后通过无电镀在其上形成厚度为0.1-20微米的镍和铜的电极。

公开(公告)号：US5963119A

公开(公告)日：1999-10-05

申请号：US853944

申请日：1997-05-09

申请人： Kazuhiro Takeda ,  Hiromi Sakita ,  Kenzou Isozaki ,  Noriya Sato

发明人： Kazuhiro Takeda ,  Hiromi Sakita ,  Kenzou Isozaki ,  Noriya Sato

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F27/30 ,  H01F5/00

CPC分类号： H01F17/0033 ,  H01F17/045 ,  H01F27/292

摘要： An inductance device wherein a conductor film is formed on a base, grooves are formed in the conductor film, a protective material is disposed on the grooves, and a length L1, a width L2 and a height L3 of the inductance device satisfy the following relation:L1=0.5 to 1.5 mm;L2=0.2 to 0.7 mm; andL3=0.2 to 0.7 mm.

摘要翻译： 一种电感器件，其中导体膜形成在基底上，在导体膜中形成沟槽，保护材料设置在沟槽上，并且电感器件的长度L1，宽度L2和高度L3满足以下关系 ：L1 = 0.5〜1.5mm; L2 = 0.2〜0.7mm; L3 = 0.2〜0.7mm。

公开(公告)号：US6131041A

公开(公告)日：2000-10-10

申请号：US317130

申请日：1999-05-24

申请人： Kazuhiro Takeda ,  Hiromi Sakita ,  Kenzou Isozaki ,  Noriya Sato

发明人： Kazuhiro Takeda ,  Hiromi Sakita ,  Kenzou Isozaki ,  Noriya Sato

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H04Q1/02 ,  H01F27/30

CPC分类号： H01F17/0033 ,  H01F17/045 ,  H01F27/292

摘要： An inductance device wherein a conductor film is formed on a base, grooves are formed in the conductor film, a protective material is disposed on the grooves, and a length L1, a width L2 and a height L3 of the inductance device satisfy-the following relation:L1=0.5 to 1.5 mm;L2=0.2 to 0.7 mm; andL3=0.2 to 0.7 mm.

摘要翻译： 一种电感器件，其中导体膜形成在基底上，在导体膜中形成沟槽，保护材料设置在沟槽上，并且电感器件的长度L1，宽度L2和高度L3满足以下条件 关系：L1 = 0.5〜1.5mm; L2 = 0.2〜0.7mm; L3 = 0.2〜0.7mm。