公开(公告)号：US12089327B2

公开(公告)日：2024-09-10

申请号：US18046280

申请日：2022-10-13

申请人： KURARAY CO., LTD.

发明人： Kikuo Arimoto ,  Takafumi Sawada ,  Yuuichi Banba ,  Shuji Nagano

IPC分类号： H05K1/03 ,  B32B15/04 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  C08J5/18 ,  C09K19/00 ,  C09K19/02 ,  C23C14/20 ,  H05K1/09 ,  H05K3/02

CPC分类号： H05K1/0353 ,  B32B15/04 ,  B32B15/043 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  C08J5/18 ,  C09K19/00 ,  C09K19/02 ,  C23C14/20 ,  C23C14/205 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/022 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0338 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12736 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12757 ,  Y10T428/12785 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/12847 ,  Y10T428/12854 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/26 ,  Y10T428/31678

摘要： Provide is a metal-coated liquid-crystal polymer film that is suitable for microcircuit processing and capable of reducing the transmission loss of circuits. The metal-coated liquid-crystal polymer film comprising: a polymer film comprising a polymer film main body capable of forming an optically anisotropic melt phase; a first metal layer layered on at least one side of the polymer film main body; and a second metal layer layered on the first metal layer, wherein in an analysis of oxygen concentration in a thickness direction using XPS, the average oxygen concentration of the first metal layer is 2.5 atom % or less.

公开(公告)号：US09958834B2

公开(公告)日：2018-05-01

申请号：US14434311

申请日：2013-09-25

申请人： THE SWATCH GROUP RESEARCH AND DEVELOPMENT LTD

发明人： Daniel Knuchel

IPC分类号： G04B37/22 ,  B23K31/02 ,  B32B15/01 ,  G04B37/00

CPC分类号： G04B37/22 ,  B23K31/02 ,  B32B15/01 ,  G04B37/00 ,  Y10T29/49579 ,  Y10T428/12868

摘要： A method of manufacturing an external timepiece component, including: a metallic base made of a first material including titanium and/or a first titanium alloy; at least one metallic cover plate made of a second material, this second material including a second metal selected from among gold and platinum and palladium, and/or a second alloy including at least gold or platinum or palladium, this at least one cover plate being of a thickness greater than or equal to 0.5 millimeters; the at least one cover plate is welded to the base to form a bimetallic blank; and the bimetallic blank is shaped and/or machined to give the structural component its final form.

公开(公告)号：US09929187B2

公开(公告)日：2018-03-27

申请号：US14296800

申请日：2014-06-05

申请人： Shuwei Sun ,  Francois-Charles Dary ,  Marc Abouaf ,  Patrick Hogan ,  Qi Zhang

发明人： Shuwei Sun ,  Francois-Charles Dary ,  Marc Abouaf ,  Patrick Hogan ,  Qi Zhang

IPC分类号： H01B1/02 ,  H01L27/12 ,  B81C1/00 ,  C22F1/04 ,  C22F1/00 ,  C22F1/08 ,  C22F1/14 ,  C21D1/00 ,  C21D9/00 ,  H01L29/66 ,  G06F3/041 ,  H01L29/49 ,  H01L23/532 ,  H01L29/786 ,  G06F3/044

CPC分类号： H01L27/1244 ,  B81C1/00 ,  B81C1/00031 ,  B81C1/00404 ,  B81C1/00523 ,  B81C1/00547 ,  C21D1/00 ,  C21D9/00 ,  C21D2201/00 ,  C21D2211/00 ,  C21D2251/00 ,  C22F1/00 ,  C22F1/04 ,  C22F1/08 ,  C22F1/14 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04103 ,  H01B1/026 ,  H01L23/53238 ,  H01L29/4908 ,  H01L29/6675 ,  H01L29/78603 ,  H01L29/78666 ,  H01L2924/0002 ,  Y10T428/12611 ,  Y10T428/1266 ,  Y10T428/12681 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  H01L2924/00

摘要： In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

公开(公告)号：US20170314152A1

公开(公告)日：2017-11-02

申请号：US15581903

申请日：2017-04-28

申请人： Korea Institute of Science and Technology ,  Korea University Research and Business Foundation

发明人： Insuk CHOI ,  Young Keun KIM

IPC分类号： C25D1/00 ,  C25D3/48 ,  C25D3/12

CPC分类号： C25D1/006 ,  B82B1/008 ,  B82B3/0014 ,  C23C28/02 ,  C25D1/04 ,  C25D3/12 ,  C25D3/48 ,  C25D5/12 ,  C25D11/045 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12944

摘要： A metal nanolaminate includes a plurality of units stacked in a longitudinal direction of the metal nanolaminate. Each of the units includes a first layer and a second layer stacked in the longitudinal direction. The first layer includes a first metal material formed of a first metallic element and the second layer includes the first metal material and a second metal material formed of a second metallic element. Each of the first layer and the second layer has a thickness of at least 5 nm but less than 100 nm in the longitudinal direction.

公开(公告)号：US20170200689A1

公开(公告)日：2017-07-13

申请号：US15107421

申请日：2015-07-22

申请人： NIPPON MICROMETAL CORPORATION ,  NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.

发明人： Takashi YAMADA ,  Daizo ODA ,  Teruo HAIBARA ,  Ryo OISHI ,  Kazuyuki SAITO ,  Tomohiro UNO

IPC分类号： H01L23/00 ,  C22C9/04 ,  C22C9/06 ,  B23K35/02 ,  B23K35/30

CPC分类号： B23K35/0227 ,  B23K35/3013 ,  B23K35/302 ,  B23K2101/40 ,  B32B15/00 ,  B32B15/01 ,  B32B15/018 ,  C22C5/04 ,  C22C9/00 ,  C22C9/04 ,  C22C9/06 ,  C23C30/00 ,  C23C30/005 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4312 ,  H01L2224/43125 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45 ,  H01L2224/45005 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45118 ,  H01L2224/4512 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45178 ,  H01L2224/45541 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48824 ,  H01L2224/78 ,  H01L2224/78251 ,  H01L2224/85 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/0665 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/186 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01045 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01031 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/00015 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/20105 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01027 ,  H01L2924/01047 ,  H01L2924/01013

摘要： A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 μm or more and 1.3 μm or less.

公开(公告)号：US08734957B2

公开(公告)日：2014-05-27

申请号：US13723573

申请日：2012-12-21

申请人： Micron Technology, Inc.

发明人： Eugene P. Marsh

IPC分类号： C23C16/02

CPC分类号： C23C16/0281 ,  C23C16/045 ,  C23C16/16 ,  C23C16/18 ,  C23C16/24 ,  C23C16/30 ,  C23C16/45525 ,  C23C16/45529 ,  C23C16/56 ,  C25D5/02 ,  C25D7/123 ,  H01L21/28562 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/32051 ,  H01L21/4846 ,  H01L21/76846 ,  H01L21/76873 ,  H01L23/5223 ,  H01L27/0805 ,  H01L28/90 ,  H01L2924/0002 ,  Y10T428/12542 ,  Y10T428/12611 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/265 ,  H01L2924/00

摘要： A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.

摘要翻译： 提供种子膜和将种子膜并入半导体应用中的方法。 种子膜包括一个或多个贵金属层，其中所述一个或多个贵金属层的每层不大于单层。 种子膜还包括一个或多个导电金属氧化物层或一个或多个氧化硅层，其中任一层不大于单层。 种子膜可用于电镀，包括电镀，导电层，至少部分种子膜。 用种子膜形成的导电层可用于制造集成电路，包括在集成电路中制造电容器结构。

公开(公告)号：US20140030542A1

公开(公告)日：2014-01-30

申请号：US13839973

申请日：2013-03-15

申请人： Jesse D. Adams ,  Steven Malekos ,  Nathalie Le Galloudec ,  Grant Korgan ,  Thomas Cowan ,  Yasuhiko Sentoku

发明人： Jesse D. Adams ,  Steven Malekos ,  Nathalie Le Galloudec ,  Grant Korgan ,  Thomas Cowan ,  Yasuhiko Sentoku

IPC分类号： H05H1/02

CPC分类号： H05H1/24 ,  G21B1/19 ,  H01J35/08 ,  H05G2/00 ,  H05G2/001 ,  H05G2/008 ,  H05H1/02 ,  Y02E30/16 ,  Y10T428/12 ,  Y10T428/12299 ,  Y10T428/1241 ,  Y10T428/12493 ,  Y10T428/12806 ,  Y10T428/12868 ,  Y10T428/12889 ,  Y10T428/13

摘要： In particular embodiments, the present disclosure provides targets including a metal layer and defining a hollow inner surface. The hollow inner surface has an internal apex. The distance between at least two opposing points of the internal apex is less than about 15 μm. In particular examples, the distance is less than about 1 μm. Particular implementations of the targets are free standing. The targets have a number of disclosed shaped, including cones, pyramids, hemispheres, and capped structures. The present disclosure also provides arrays of such targets. Also provided are methods of forming targets, such as the disclosed targets, using lithographic techniques, such as photolithographic techniques. In particular examples, a target mold is formed from a silicon wafer and then one or more sides of the mold are coated with a target material, such as one or more metals.

摘要翻译： 在具体实施方案中，本公开提供了包括金属层并限定中空内表面的靶。 中空的内表面具有内部顶点。 内部顶点的至少两个相对的点之间的距离小于约15μm。 在具体示例中，距离小于约1um。 目标的具体实现是独立的。 目标具有许多公开的形状，包括锥体，金字塔，半球和封盖结构。 本公开还提供了这样的靶的阵列。 还提供了使用光刻技术（诸如光刻技术）形成靶的方法，例如所公开的靶。 在具体实例中，目标模具由硅晶片形成，然后模具的一侧或多侧涂覆有目标材料，例如一种或多种金属。

公开(公告)号：US08409726B2

公开(公告)日：2013-04-02

申请号：US12475764

申请日：2009-06-01

申请人： Chang-han Shim ,  Sung-il Kang ,  Se-chuel Park

发明人： Chang-han Shim ,  Sung-il Kang ,  Se-chuel Park

IPC分类号： B32B15/20

CPC分类号： H05K3/384 ,  C25D5/12 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12514 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/24917

摘要： Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.

摘要翻译： 提供了具有多个金属层的印刷电路板（PCB）和制造PCB以提高金属膜和形成电路图案的聚合物膜之间的粘附性的方法。 PCB包括：第一金属膜; 形成在所述第一金属膜的一个表面上的聚合物膜; 以及介于所述第一金属膜和所述聚合物膜之间的第二金属膜，具有面向所述第一金属膜的第一表面和面向所述聚合物膜的第二表面，其中所述第二表面比所述第一表面更粗糙。

公开(公告)号：US07964975B2

公开(公告)日：2011-06-21

申请号：US12320559

申请日：2009-01-29

申请人： Ryoichi Kajiwara ,  Shigehisa Motowaki ,  Kazutoshi Itou ,  Hiroshi Hozoji

发明人： Ryoichi Kajiwara ,  Shigehisa Motowaki ,  Kazutoshi Itou ,  Hiroshi Hozoji

IPC分类号： H01L23/48 ,  B05D3/02

CPC分类号： H01L23/49582 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2203/121 ,  Y10T428/12493 ,  Y10T428/12868 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012

摘要： A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body.

摘要翻译： 根据本发明的金属基/聚合物 - 树脂结合结构体的制造方法包括以下步骤：（1）向金属基材的表面施加含有可在350℃分解的有机金属化合物的溶液。 或更低; （2）在氧化气氛中烘烤涂布的溶液，在金属基材的表面形成含有有机金属化合物的金属的氧化物的涂层; （3）在涂层上提供聚合物树脂; 和（4）硬化聚合物树脂以提供金属基/聚合物 - 树脂结合体。

公开(公告)号：US20100028707A1

公开(公告)日：2010-02-04

申请号：US12066479

申请日：2006-09-12

申请人： Thomas E. Cowan ,  Steven Malekos ,  Grant Korgan ,  Jesse Adams ,  Yasuhiko Sentoku ,  Nathalie Le Galloudec ,  Julien Fuchs

发明人： Thomas E. Cowan ,  Steven Malekos ,  Grant Korgan ,  Jesse Adams ,  Yasuhiko Sentoku ,  Nathalie Le Galloudec ,  Julien Fuchs

IPC分类号： B32B15/01 ,  B32B1/00

CPC分类号： H05H1/24 ,  G21B1/19 ,  H01J35/08 ,  H05G2/00 ,  H05G2/001 ,  H05G2/008 ,  H05H1/02 ,  Y02E30/16 ,  Y10T428/12 ,  Y10T428/12299 ,  Y10T428/1241 ,  Y10T428/12493 ,  Y10T428/12806 ,  Y10T428/12868 ,  Y10T428/12889 ,  Y10T428/13

摘要： In particular embodiments, the present disclosure provides targets including a metal layer and defining a hollow inner surface. The hollow inner surface has an internal apex. The distance between at least two opposing points of the internal apex is less than about 15 μm. In particular examples, the distance is less than about lam. Particular implementations of the targets are free standing. The targets have a number of disclosed shaped, including cones, pyramids, hemispheres, and capped structures. The present disclosure also provides arrays of such targets. Also provided are methods of forming targets, such as the disclosed targets, using lithographic techniques, such as photolithographic techniques. In particular examples, a target mold is formed from a silicon wafer and then one or more sides of the mold are coated with a target material, such as one or more metals.

摘要翻译： 在具体实施方案中，本公开提供了包括金属层并限定中空内表面的靶。 中空的内表面具有内部顶点。 内部顶点的至少两个相对的点之间的距离小于约15μm。 在具体示例中，距离小于约lam。 目标的具体实现是独立的。 目标具有许多公开的形状，包括锥体，金字塔，半球和封盖结构。 本公开还提供了这样的靶的阵列。 还提供了使用光刻技术（诸如光刻技术）形成靶的方法，例如所公开的靶。 在具体实例中，目标模具由硅晶片形成，然后模具的一侧或多侧涂覆有目标材料，例如一种或多种金属。