公开(公告)号：US5023065A

公开(公告)日：1991-06-11

申请号：US265862

申请日：1988-09-26

申请人： Kazuhisa Ohno ,  Tetsushi Kosugi ,  Kenichiro Sugimori ,  Akitsugu Ando ,  Masaru Yamamoto ,  Fukuji Suzuki ,  Masahiro Nakamura ,  Nobuhisa Tsujita

发明人： Kazuhisa Ohno ,  Tetsushi Kosugi ,  Kenichiro Sugimori ,  Akitsugu Ando ,  Masaru Yamamoto ,  Fukuji Suzuki ,  Masahiro Nakamura ,  Nobuhisa Tsujita

IPC分类号： C01B33/26 ,  C01B33/42 ,  C09C1/00 ,  C09C1/28 ,  C09C1/40

CPC分类号： A61K8/26 ,  A61Q1/02 ,  B82Y30/00 ,  C01B33/28 ,  C01B33/425 ,  C09C1/28 ,  A61K2800/43 ,  A61Q1/08 ,  A61Q1/12 ,  A61Q3/02 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/20 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/60 ,  C01P2006/65 ,  C01P2006/80 ,  Y10T428/2982

摘要： The present invention concerns synthetic mica powder containing from 75 to 99% of the stoichiometrical composition of fluorine and/or having a shape in which the end face of particle is laminated, process for producing such synthetic mica powder, as well as cosmetics having synthetic mica powder blended therewith, in which the synthetic mica powder shows no leaching of fluorine ions and/or improved hold of oils due to lamination at the surface of powder. Accordingly, in this invention, cosmetics excellent in extensibility, gloss, adherence and modability, having appearance of high chroma and of high stability and safety can be obtained.

公开(公告)号：US5094852A

公开(公告)日：1992-03-10

申请号：US639444

申请日：1991-01-10

申请人： Kazuhisa Ohno ,  Tetsushi Kosugi ,  Kenichiro Sugimori ,  Akitsugu Ando ,  Masaru Yamamoto ,  Fukuji Suzuki ,  Masahiro Nakamura ,  Nobuhisa Tsujita

发明人： Kazuhisa Ohno ,  Tetsushi Kosugi ,  Kenichiro Sugimori ,  Akitsugu Ando ,  Masaru Yamamoto ,  Fukuji Suzuki ,  Masahiro Nakamura ,  Nobuhisa Tsujita

IPC分类号： C01B33/26 ,  C01B33/42 ,  C09C1/00 ,  C09C1/28 ,  C09C1/40

CPC分类号： A61K8/26 ,  A61Q1/02 ,  B82Y30/00 ,  C01B33/28 ,  C01B33/425 ,  C09C1/28 ,  A61K2800/43 ,  A61Q1/08 ,  A61Q1/12 ,  A61Q3/02 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/20 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/60 ,  C01P2006/65 ,  C01P2006/80 ,  Y10T428/2982

摘要： The present invention concerns synthetic mica powder containing from 75 to 99% of the stoichiometrical composition of fluorine and/or having a shape in which the end face of particle is laminated, process for producing such synthetic mica powder, as well as cosmetics having synthetic mica powder blended therewith, in which the synthetic mica powder shows no leaching of fluorine ions and/or improved hold of oils due to lamination at the surface of powder. Accordingly, in this invention, cosmetics excellent in extensibility, gloss, adherence and modability, having appearance of high chroma and of high stability and safety can be obtained.

公开(公告)号：US5098712A

公开(公告)日：1992-03-24

申请号：US570061

申请日：1990-08-20

申请人： Kazuhisa Ohno ,  Tetsushi Kosugi ,  Kenichiro Sugimori ,  Akitsugau Ando ,  Masaru Yamamoto ,  Fukuji Suzuki ,  Masahiro Nakamura ,  Nobuhisa Tsujita

发明人： Kazuhisa Ohno ,  Tetsushi Kosugi ,  Kenichiro Sugimori ,  Akitsugau Ando ,  Masaru Yamamoto ,  Fukuji Suzuki ,  Masahiro Nakamura ,  Nobuhisa Tsujita

IPC分类号： C01B33/26 ,  C01B33/42 ,  C09C1/00 ,  C09C1/28 ,  C09C1/40

CPC分类号： A61K8/26 ,  A61Q1/02 ,  B82Y30/00 ,  C01B33/28 ,  C01B33/425 ,  C09C1/28 ,  A61K2800/43 ,  A61Q1/08 ,  A61Q1/12 ,  A61Q3/02 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/20 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/60 ,  C01P2006/65 ,  C01P2006/80 ,  Y10T428/2982

摘要： The present invention concerns synthetic mica powder containing from 75 to 99% of the stoichiometrical composition of fluorine and/or having a shape in which the end face of a particle is laminated, a process for producing such synthetic mica powder, as well as cosmetics having synthetic mica powder blended therewith, in which the synthetic mica powder shows no leaching of fluorine ions and/or improved hold of oils due to lamination at the surface of the powder. Accordingly, in this invention, cosmetics excellent in extensibility, gloss, adherence and moldability, having an appearance of high chroma and of high stability and safety can be obtained.

公开(公告)号：US4845065A

公开(公告)日：1989-07-04

申请号：US188160

申请日：1988-04-15

申请人： Kenichiro Sugimori ,  Masaru Yamamoto ,  Ikuo Horii ,  Shigeo Ishiguro ,  Hajime Matsushita ,  Hiroshi Ichinose ,  Shigenobu Mizusaki

发明人： Kenichiro Sugimori ,  Masaru Yamamoto ,  Ikuo Horii ,  Shigeo Ishiguro ,  Hajime Matsushita ,  Hiroshi Ichinose ,  Shigenobu Mizusaki

IPC分类号： B01D53/86 ,  B01J23/22 ,  B01J23/89 ,  B01J27/198

CPC分类号： B01J23/002 ,  B01D53/864 ,  B01J23/22 ,  B01J23/898 ,  B01J27/198 ,  B01J2523/00

摘要： A carbon monoxide oxidizing catalyst for removing carbon monoxide from an air comprises a porous carrier, and on said carrier, a palladium salt and a copper salt as main active components and a vanadium compound or a vanadium compound and a phosphorous compound as a promotor.

摘要翻译： 用于从空气中除去一氧化碳的一氧化碳氧化催化剂包括多孔载体，所述载体上以钯盐和铜盐为主要活性组分，钒化合物或钒化合物和磷化合物作为促进剂。

公开(公告)号：US20110274937A1

公开(公告)日：2011-11-10

申请号：US13145163

申请日：2010-01-18

申请人： Kenichiro Sugimori ,  Seiji Yamada ,  Satoshi Kawakubo ,  Atsushi Irisawa

发明人： Kenichiro Sugimori ,  Seiji Yamada ,  Satoshi Kawakubo ,  Atsushi Irisawa

IPC分类号： B32B15/04 ,  B23K35/34 ,  C22C13/00

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K2101/36 ,  Y10T428/31678

摘要： [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material.[MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core.[SELECTED FIGURE] FIG. 2

摘要翻译： [待解决的问题]为了提供耐湿性优异且耐热疲劳性优异的低银无铅焊料合金，耐疲劳性优异的焊锡膏焊料和树脂焊剂芯焊料， 以及通过使用焊接材料的接合产品。 [用于溶解] 0.1〜1.5重量％的Cu，0.01重量％以上且小于0.05重量％的Co，0.05〜0.25重量％的Ag，0.001〜0.008重量％的Ge， 余数为Sn。 这种低银无铅焊料合金与糊状焊剂混合，或者通过使用固体或糊状焊剂作为核心以衬垫形式模制。 [选择的图] 2

公开(公告)号：US20100233018A1

公开(公告)日：2010-09-16

申请号：US12305794

申请日：2007-07-20

申请人： Seiji Yamada ,  Kenichiro Sugimori

发明人： Seiji Yamada ,  Kenichiro Sugimori

IPC分类号： B23K35/24 ,  C22C13/02

CPC分类号： C22C13/00 ,  B23K35/262

摘要： Provided is an SnCu lead-free solder alloy which eliminates a drawback that an intermetallic compound excessively precipitates and the precipitate serves as nuclei to form dross to thereby cause soldering defects including a needle-like protrusion to occur, thus to satisfy all of the properties required for practical use.A lead-free solder alloy contains 0.1 to 1.5% by weight of Cu, not less than 0.01 and less than 0.05% by weight of Co, 0.05 to 0.5% by weight of Ag and 0.01 to 0.1% by weight of Sb, the remainder being Sn, or further contains 0.001 to 0.008% by weight of Ge, whereby the formation of dross is prevented, and thus the drawback that soldering defects including a needle-like protrusion occur is eliminated.

摘要翻译： 提供了一种SnCu无铅焊料合金，其消除了金属间化合物过度沉淀的缺点，并且沉淀物用作形成浮渣的核，从而引起包括针状突起的焊接缺陷，从而满足所有所需的所有性能 供实际使用。 无铅焊料合金含有0.1〜1.5重量％的Cu，不小于0.01重量％，小于0.05重量％的Co，0.05〜0.5重量％的Ag和0.01〜0.1重量％的Sb，余量 为Sn，或进一步含有0.001〜0.008重量％的Ge，由此防止浮渣的形成，因此消除了包括针状突起发生的焊接缺陷的缺点。