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    LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS
    1.
    发明申请
    LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS 审中-公开
    无铅焊接合金，含有焊料合金的耐疲劳耐火材料和使用焊接材料加工的产品

    公开(公告)号：US20110274937A1

    公开(公告)日：2011-11-10

    申请号：US13145163

    申请日：2010-01-18

    申请人： Kenichiro Sugimori ,  Seiji Yamada ,  Satoshi Kawakubo ,  Atsushi Irisawa

    发明人： Kenichiro Sugimori ,  Seiji Yamada ,  Satoshi Kawakubo ,  Atsushi Irisawa

    IPC分类号： B32B15/04 ,  B23K35/34 ,  C22C13/00

    CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K2101/36 ,  Y10T428/31678

    摘要： [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material.[MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core.[SELECTED FIGURE] FIG. 2

    摘要翻译： [待解决的问题]为了提供耐湿性优异且耐热疲劳性优异的低银无铅焊料合金，耐疲劳性优异的焊锡膏焊料和树脂焊剂芯焊料， 以及通过使用焊接材料的接合产品。 [用于溶解] 0.1〜1.5重量％的Cu，0.01重量％以上且小于0.05重量％的Co，0.05〜0.25重量％的Ag，0.001〜0.008重量％的Ge， 余数为Sn。 这种低银无铅焊料合金与糊状焊剂混合，或者通过使用固体或糊状焊剂作为核心以衬垫形式模制。 [选择的图] 2

    SOLDERING PASTE AND FLUX
    3.
    发明申请
    SOLDERING PASTE AND FLUX 有权
    焊接和焊接

    公开(公告)号：US20130186519A1

    公开(公告)日：2013-07-25

    申请号：US13876949

    申请日：2011-03-09

    申请人： Atsushi Irisawa ,  Masashi Kashiwabara ,  Kenji Kondo ,  Masahito Hidaka

    发明人： Atsushi Irisawa ,  Masashi Kashiwabara ,  Kenji Kondo ,  Masahito Hidaka

    IPC分类号： B23K35/26

    CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3616 ,  B23K35/3618 ,  B23K35/362 ,  C22C1/0483 ,  C22C13/00 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/3489

    摘要： The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained.

    摘要翻译： 本发明的目的是提供一种焊膏，其能够在-40℃至150℃的100次热冲击循环中形成在焊接部分中具有抗裂纹性的电子部件的表面安装结构。 根据需要在车辆用途的发动机附近使用。 将包含胺卤素盐和二羧酸的助熔剂与Sn-Ag-Bi-In合金粉末捏合。 结果，获得了在-40℃至150℃下的100次热冲击循环中具有长的连续印刷性，焊球几乎不发生的焊膏和优异的接合能力而无裂纹。