公开(公告)号：US08864925B2

公开(公告)日：2014-10-21

申请号：US13811167

申请日：2011-07-21

申请人： Kazunari Kimura ,  Misaki Tabata ,  Shigemitsu Tomaki ,  Akira Nakamura ,  Isao Abe ,  Noriyuki Saito

发明人： Kazunari Kimura ,  Misaki Tabata ,  Shigemitsu Tomaki ,  Akira Nakamura ,  Isao Abe ,  Noriyuki Saito

IPC分类号： C03B29/00 ,  H01G4/40 ,  H01G4/005 ,  B32B18/00 ,  B32B5/00 ,  B32B38/00 ,  H01G4/30 ,  H01G4/12 ,  B29C65/00 ,  H03H1/00 ,  H03H7/01

CPC分类号： B32B38/0004 ,  B32B5/00 ,  B32B18/00 ,  B32B38/0036 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/76 ,  C04B2237/80 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H03H7/0115 ,  H03H2001/0085 ,  Y10T156/1089 ,  Y10T428/24058

摘要： A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

摘要翻译： 层叠电子部件的制造方法包括：通过层叠由烧结陶瓷材料制成的绝缘功能层和导体层来制造第一层压片和第二层叠片，所述导体层具有沿垂直方向和水平方向二维排列的多个导体 组成电路元件的一部分; 将第一和第二层压片切割成棒以产生多个第一和第二层压棒; 通过将第二层压棒旋转90°来制造第三层压片，将第二层压棒布置在每个夹在第一层压棒之间，并将它们热压粘合用于一体化; 将第三层压片材切成芯片并通过烧结未烧结的芯片来制造烧结体，以将第一层压体与第二层压体集成。

公开(公告)号：US20130266758A2

公开(公告)日：2013-10-10

申请号：US13811167

申请日：2011-07-21

申请人： Kazunari Kimura ,  Misaki Tabata ,  Shigemitsu Tomaki ,  Akira Nakamura ,  Isao Abe ,  Noriyuki Saito

发明人： Kazunari Kimura ,  Misaki Tabata ,  Shigemitsu Tomaki ,  Akira Nakamura ,  Isao Abe ,  Noriyuki Saito

IPC分类号： B32B38/00 ,  B32B18/00 ,  B32B5/00

CPC分类号： B32B38/0004 ,  B32B5/00 ,  B32B18/00 ,  B32B38/0036 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/76 ,  C04B2237/80 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H03H7/0115 ,  H03H2001/0085 ,  Y10T156/1089 ,  Y10T428/24058

摘要： A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

摘要翻译： 层叠电子部件的制造方法包括：通过层叠由烧结陶瓷材料制成的绝缘功能层和导体层来制造第一层压片和第二层叠片，所述导体层具有沿垂直方向和水平方向二维排列的多个导体 组成电路元件的一部分; 将第一和第二层压片切割成棒以产生多个第一和第二层压棒; 通过将第二层压棒旋转90°来制造第三层压片，将第二层压棒布置在每个夹在第一层压棒之间，并将它们热压粘合用于一体化; 将第三层压片材切成芯片并通过烧结未烧结的芯片来制造烧结体，以将第一层压体与第二层压体集成。

公开(公告)号：US20130115411A1

公开(公告)日：2013-05-09

申请号：US13811167

申请日：2011-07-21

申请人： Kazunari Kimura ,  Misaki Tabata ,  Shigemitsu Tomaki ,  Akira Nakamura ,  Isao Abe ,  Noriyuki Saito

发明人： Kazunari Kimura ,  Misaki Tabata ,  Shigemitsu Tomaki ,  Akira Nakamura ,  Isao Abe ,  Noriyuki Saito

IPC分类号： B32B38/00 ,  B32B18/00 ,  B32B5/00

CPC分类号： B32B38/0004 ,  B32B5/00 ,  B32B18/00 ,  B32B38/0036 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/76 ,  C04B2237/80 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H03H7/0115 ,  H03H2001/0085 ,  Y10T156/1089 ,  Y10T428/24058

摘要： A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

公开(公告)号：US20120313743A1

公开(公告)日：2012-12-13

申请号：US13580021

申请日：2011-09-07

申请人： Kazunari Kimura ,  Shigemitsu Tomaki ,  Misaki Tabata ,  Isao Abe

发明人： Kazunari Kimura ,  Shigemitsu Tomaki ,  Misaki Tabata ,  Isao Abe

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  H01F2017/004

摘要： A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.

摘要翻译： 层叠电子部件包括第一层压体和包含前布线层并与第一层压体接合的第二层压体。 第一层压体和第二层压体的接线层彼此正交。 第一层压体具有布置在第一布线层上的第一电感器导体和布置在第二布线层上的第二电感器导体。 第二层压体具有用于将第一电感器导体的端部与第二电感器导体的端部电连接到第一层压体的表面上的连接导体，使得第一电感器导体和第二电感器导体形成 线圈形电感器。