公开(公告)号：US20070108424A1

公开(公告)日：2007-05-17

申请号：US11621613

申请日：2007-01-10

申请人： Kazuyoshi Shioiri ,  Tetsuya Yoshida ,  Yuusuke Kawahara ,  Kazuyoshi Ichikawa

发明人： Kazuyoshi Shioiri ,  Tetsuya Yoshida ,  Yuusuke Kawahara ,  Kazuyoshi Ichikawa

IPC分类号： H01B1/12

CPC分类号： H05K1/097 ,  C09D11/322 ,  C09D11/326 ,  H05K3/125

摘要： A conductive pattern forming composition, containing in a dispersion medium conductive fine particles composed of at least one kind of metal and a dispersant for dispersing the conductive fine particles, wherein the dispersant is a polymer containing a tertiary amine-type monomer in a main chain and a polyether-type nonionic monomer in a side chain.

摘要翻译： 一种导电图案形成用组合物，其在分散介质中含有由至少一种金属构成的导电性微粒和用于分散导电性微粒的分散剂，其中，所述分散剂是在主链中含有叔胺型单体的聚合物， 侧链中的聚醚型非离子单体。

公开(公告)号：US07037812B2

公开(公告)日：2006-05-02

申请号：US10668777

申请日：2003-09-22

申请人： Yuusuke Kawahara ,  Tetsuya Yoshida ,  Kazuhiro Murata ,  Hiroshi Yokoyama

发明人： Yuusuke Kawahara ,  Tetsuya Yoshida ,  Kazuhiro Murata ,  Hiroshi Yokoyama

IPC分类号： H01L21/20

CPC分类号： H01L21/67138 ,  H05K3/125

摘要： A manufacturing method of a circuit substrate, in which an electronic circuit is formed on a surface of a base member by a solution jetting device. The manufacturing method comprises: jetting liquid drops of a solution which is supplied into a nozzle having a discharge port with an inner diameter of 0.1 μm to 100 μm and includes a plurality of fine particles to form an electronic circuit by melting and sticking to one another and a dispersant for dispersing the fine particles, from the discharge port toward the surface of the base member by applying a voltage of an arbitrary waveform to the solution to charge the solution; and exposing the jetted liquid drops received on the surface of the base member to light or heat to make the fine particles melt and stick to one another.

摘要翻译： 一种电路基板的制造方法，其中通过溶液喷射装置在基底构件的表面上形成电子电路。 该制造方法包括：将溶液的液滴喷射到具有内径为0.1μm至100μm的排出口的喷嘴中，并且包括多个细小颗粒，以通过熔化和粘附而形成电子电路 以及分散剂，其通过向所述溶液施加任意波形的电压，从所述排出口朝向所述基材的表面分散所述微粒，以对所述溶液进行充电; 并将接收在基体表面上的喷射液滴暴露于光或加热，使细颗粒彼此融合并粘合。