摘要:
An input detection device including: a reading part reading touch inputs from an input interface of a touch sensor by scanning every above two electrode lines which are adjacent on the scanning sequence from an end of the input interface to the opposite end, and acquiring a difference between detection data obtained from a half of the above two electrode lines which are successive and from the other half of the above two electrode lines which are successive; and a calculation part integrating the differences for the entire input interface to obtain touch information, wherein if an integration result obtained in the case where the above two lines stretches over the scanning finish end and the scanning start end is not satisfied with a predetermined value, the calculation part resets the detection data obtained from the electrode line located at the scanning finish end to be the predetermined value.
摘要:
The invention provides an input detection method, wherein when multiple touch points are input a touch sensor 30 detects touch points 41, 42 individually. The detection method includes: scanning a first electrode line, and if a plurality of touch areas 43, 45 sandwiching a non-touch area 44 are detected, labeling the plurality of touch areas 43, 45 sequentially; determining the location of the non-touch area as a separation area in the case where the non-touch area between the labels is within a predetermined spacing; when a second electrode line next to the first electrode line where a separation area is detected is scanned, handling the area on the second electrode line corresponding to the separation area on the first electrode line as a separation area; and practicing the above steps for every electrode line and detecting the labels.
摘要:
A touch panel and an electronic device are provided. The touch panel includes a sensing electrode array, a touch controller, and an electrostatic discharge (ESD) protection circuit. The sensing electrode array is arranged in two dimensional array of n rows and m columns for generating a sensing signal in response to a touch on the touch panel. The touch controller is operationally connected to the sensing electrode array for receiving the sensing signal and identifying the touch on the touch screen. The ESD protection circuit includes ESD protection units each being electrically connected to a corresponding row or column of the sensing electrode array and the touch controller for electrostatic discharge protection.
摘要:
A photodiode excellent in responsivity receives flashes of light emitted from flash lamps in the process of heating a semiconductor wafer by irradiation with flashes of light, and the waveform of the intensity of the flashes of light versus time is acquired using voltage data obtained from an output from the photodiode. Then, a temperature calculating part performs a heat conduction simulation using the acquired data to calculate the temperature of the semiconductor wafer irradiated with the flashes of light from the flash lamps. The temperature of the semiconductor wafer is computed using data corresponding to the intensity of the flashes of light obtained from the output from the photodiode. This allows the determination of the surface temperature of the semiconductor wafer irradiated with the flashes of light, irrespective of the waveform of the emission intensity of the flash lamps.
摘要:
After flash irradiation on a semiconductor wafer is started and then the temperatures of front and back surfaces of the semiconductor wafer become equal to each other, the temperature of the back surface of the semiconductor wafer, which has a known emissivity, is measured with a radiation thermometer. The emissivity of the front surface of the semiconductor wafer is calculated based on the intensity of radiated light from a black body having an equal temperature to the temperature of the back surface thereof, and the intensity of radiated light actually radiated from the front surface of the semiconductor wafer. Then, the temperature of the front surface of the semiconductor wafer heated by the flash irradiation is calculated based on the calculated emissivity and the intensity of the radiated light from the front surface of the semiconductor wafer that has been measured after the flash irradiation is started.
摘要:
A photodetector element for receiving radiated light from a surface of a semiconductor wafer loses a detection function because the intensity of the received light exceeds a detection limit while a flash lamp emits light. Measurement is not performed during the above-mentioned period, and the intensity of the radiated light from the surface of the semiconductor wafer is measured after the flash lamp stops emitting light and the photodetector element restores the detection function. Then, the temperature of the surface of the semiconductor wafer heated by irradiation with a flash of light is calculated based on the measured intensity of the radiated light. Accordingly, even in a case where intense irradiation is performed in an extremely short period of time, such as flash irradiation, the flash of light does not act as ambient light, which enables to obtain the surface temperature of the semiconductor wafer.
摘要:
A source driver circuit of an LCD apparatus with a small occupied area and low power consumption is disclosed. The source driver circuit comprises a reference voltage circuit, a negative voltage driving DAC, a positive voltage driving DAC, an invert amplifier, a non-invert amplifier and a voltage selector. The reference voltage circuit generates a reference voltage. The negative voltage driving DAC divides the display data into negative gradation voltages. The positive voltage driving DAC divides the display data into positive gradation voltages. The invert amplifier works as an analogue buffer for the negative gradation voltages for driving the LCD apparatus and the non-invert amplifier works as an analogue buffer for the positive gradation voltages for driving the LCD apparatus. The voltage selector provides the reference voltage to the positive and negative voltage driving DACs.