摘要:
A socket connector (100) comprises a socket body (5), a plurality of contacts (3) received in the socket body (5), a lid (1) movably mounted on the socket body (5) and moving up and down along a vertical direction, a moving plate (4) movably mounted upon the socket body (5) and moving along a horizontal direction and an operating lever (2) located between the lid (1) and the moving plate (4), the operating lever (2) comprises a press member (22), the press member (22) presses on the top surface of the moving plate (4) to prevent the floating of the moving plate (4) in the vertical direction.
摘要:
An IC socket includes a base receiving a number of contacts, a lid mounted upon the base, and at least one latch mounted in the base. The lid is able to be operated between a first position away from the base and a second position adjacent to the base. The latch is driven by the lid to open and close. At least one stopper is disposed on the lid and extends into a recess defined on the latch to lock with latch the latch when the lid located at the first position for preventing the lid from dropping from the base.
摘要:
An IC socket includes a base receiving a number of contacts, a lid mounted upon the base, and at least one latch mounted in the base. The lid is able to be operated between a first position away from the base and a second position adjacent to the base. The latch is driven by the lid to open and close. At least one stopper is disposed on the lid and extends into a recess defined on the latch to lock with latch the latch when the lid located at the first position for preventing the lid from dropping from the base.
摘要:
A socket connector includes a socket body, a moving plate movably mounted upon the socket body, and an actuating mechanism. The actuating mechanism comprises a lid, a first operating lever, and a second operating lever. The first and second operating levers are disposed between the lid and moving plate with opposite tilted angles. The first operating lever has a cam section engaged with a bearing section formed on the moving plate so as to drive the moving plate to move in a substantially horizontal direction.
摘要:
A burn-in socket for receiving an IC package includes a base, a platform located within the base for loading the IC package, a number of contacts arranged in the base for connecting with the IC package, a cover movably mounted upon the base, and at least one slider arrangement actuated by the cover. The slider arrangement comprises a first rod pivotally connected to the cover, a slider capable of abutting against the IC package, and a second rod with one end pivotally connected to the first rod and the other end pivotally connected to the slider.
摘要:
An optical board (100) includes a base layer (1), an optical module (4) assembled to the base layer, and an optical layer (2) attached to the base layer and defining a receiving recess (23). The optical module includes a ferrule (41) received in the receiving recess and defining a number of grooves (4131), and a number of optical circuits (42) positioned in the grooves of the ferrule. The optical circuits extend outside of the ferrule and into the optical layer.
摘要:
A test socket, adapted for connecting the semiconductor package and a printed circuit board comprises a base and a plurality of contacts received in the base. The base has a retaining board defining a plurality of first receiving holes and a positioning board defining a plurality of second receiving holes. The contacts has a contacting portion, an elastic portion and a retaining portion, the elastic portion is disposed between the retaining board and the positioning board and protruding rightward, and the contacting portion extends beyond the elastic portion and defines a acute angle with a horizontal line in a right hand before contacting with the semiconductor package to prevent the contacting portion from scratching with the left inner sidewall of the second receiving hole when pushed downward by the semiconductor package and rotating leftward.
摘要:
A burn-in socket for receiving an IC package includes a base, a platform located within the base for loading the IC package, a number of contacts arranged in the base for connecting with the IC package, a cover movably mounted upon the base, and at least one slider arrangement actuated by the cover. The slider arrangement comprises a first rod pivotally connected to the cover, a slider capable of abutting against the IC package, and a second rod with one end pivotally connected to the first rod and the other end pivotally connected to the slider.
摘要:
A socket connector comprises an insulating base receiving a plurality of contacts, a movable frame assembled to the insulating base, at least one latch device pivotally assembled to the insulating base, and at least one actuating member corresponding to the latch device and retained on a sidewall of the movable frame. The at least one actuating member includes a driving portion disposed at inner edge of the sidewall of the movable frame and extending downwardly. The movable frame is able to move up and down relative to the insulating base. Each latch device includes a latching member having a pressing portion with a cuneiform outside surface. When the actuating member moves up and down together with the movable frame, the driving portion of the actuating member pushes the cuneiform outside surface of the pressing portion of the latch device to shift between a closed position and an opened position.
摘要:
An IC socket for receiving an IC package comprises a socket body for carrying the IC package. A plurality of contacts are received in the socket body for electrical connection with the IC package. A driving member is mounted upon the socket body and able to operate between an upper position and a lower position. At least one latch device comprises an upper section, a lower section parallel to the upper section and a regulator. The regular links the upper section and the lower section and force the lower section to move relative to the upper section.