公开(公告)号：US5327267A

公开(公告)日：1994-07-05

申请号：US983750

申请日：1992-12-01

申请人： Keigo Aoki ,  Yoshinao Ohnuma

发明人： Keigo Aoki ,  Yoshinao Ohnuma

IPC分类号： G02F1/133 ,  G02F1/13 ,  G02F1/1345 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  G02F1/1343

CPC分类号： G02F1/136204

摘要： A dielectric display device includes a pair of substrates, at least one of which is transparent, spaced in parallel a constant distance apart, and facing each other. A dielectric display material is inserted between the pair of substrates. Further, a pair of electrodes, at least one of which includes a plurality of line (or scanning) electrodes, are disposed on the sides of the substrate facing the other substrate. Finally, a static erasing conductor is disposed extending peripherally along, and spaced a constant distance from, the ends of the electrodes for preventing intrusion of static electricity into electric lead lines.

摘要翻译： 电介质显示装置包括一对基板，其中至少一个是透明的，间隔开恒定的距离并相互面对。 电介质显示材料插入在一对基板之间。 此外，一对电极，其中至少一个包括多个线（或扫描）电极）设置在面向另一个基板的基板的侧面上。 最后，静电擦除导体被布置成沿电极的端部沿着电极端部延伸并且间隔开恒定的距离，以防止静电侵入电引线。

公开(公告)号：US5290197A

公开(公告)日：1994-03-01

申请号：US974902

申请日：1992-11-12

申请人： Yoshinao Ohnuma ,  Yasunobu Tagusa

发明人： Yoshinao Ohnuma ,  Yasunobu Tagusa

IPC分类号： G02F1/1345 ,  G02F1/13 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/28

CPC分类号： H01L24/28 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/49146

摘要： A method for mounting a semiconductor chip on a first wire board, bonding a second wire board to a connecting terminal of the first wire board with a thermo-setting layer of anisotropic conductivity, covering the undersurface and periphery of the semiconductor chip by a first thermo-setting epoxy resin so as to embed and seal the semiconductor chip therein, and cover the connecting part of the first wire board and the second wire board by a second thermo-setting epoxy resin.

摘要翻译： 一种用于将半导体芯片安装在第一线路板上的方法，用具有各向异性导电性的热固定层将第二线路板连接到第一线路板的连接端子，通过第一热电偶覆盖半导体芯片的下表面和周边 将环氧树脂固化以将半导体芯片嵌入并密封，并且通过第二热固性环氧树脂覆盖第一线板和第二线板的连接部分。