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公开(公告)号：US10724804B2
公开(公告)日：2020-07-28
申请号：US15806723
申请日：2017-11-08
发明人： Ryan John Lewis , Ronggui Yang , Yung-Cheng Lee
摘要： A thermal ground plane with hybrid structures that include nanowires is disclosed. The thermal ground plane includes a first casing having an exterior surface and an interior surface, the interior surface includes plurality of microstructures with a plurality of nanowires; a second casing, wherein the first casing and the second casing are sealed to an interior space that includes a working fluid; and a wicking layer disposed within the interior space.
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公开(公告)号：US20190390919A1
公开(公告)日：2019-12-26
申请号：US16539848
申请日：2019-08-13
发明人： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
摘要： Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US20230332841A1
公开(公告)日：2023-10-19
申请号：US18180122
申请日：2023-03-07
发明人： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
IPC分类号： F28D15/04
CPC分类号： F28D15/046
摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
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公开(公告)号：US20160161193A1
公开(公告)日：2016-06-09
申请号：US14925787
申请日：2015-10-28
发明人： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
CPC分类号： F28D15/046 , B23P15/26 , B81C1/00388 , B81C2201/0108 , C23F4/00 , F28D15/0233 , F28F13/187
摘要： Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
摘要翻译： 本文描述的实施例涉及基于聚合物的热接地平面的概念和设计。 根据一个实施例，使用聚合物作为制造热接地平面的材料。 其他实施方案包括使用两个微柱阵列的优化芯吸结构设计，使用铜/聚合物处理的TGP的基于光刻的微加工，微柱，嵌入微柱中的节流释放孔，原子层沉积（ALD）亲水 涂层，节流流体充填结构和密封方法，无缺陷ALD气密涂层，符合结构设计。
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公开(公告)号：US20220155025A1
公开(公告)日：2022-05-19
申请号：US17592490
申请日：2022-02-03
发明人： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
摘要： Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US20200182557A1
公开(公告)日：2020-06-11
申请号：US16710180
申请日：2019-12-11
发明人： Ryan John Lewis , Takuo Wakaoka , Keijiro Kojima
摘要： To provide a vapor chamber having excellent function of circulating a working liquid from an end portion to a center portion of a wick and enabling the prevention of the occurrence of dry-out. A vapor chamber includes a casing formed of a first sheet and a second sheet which face each other and whose outer peripheries are bonded to each other; a working liquid sealed in the casing; and a wick disposed on an inner wall surface of the first sheet or the second sheet. A wall portion is disposed around the wick as viewed in a top plan view of an inside of the casing.
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公开(公告)号：US20200300563A1
公开(公告)日：2020-09-24
申请号：US15930016
申请日：2020-05-12
发明人： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
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公开(公告)号：US09921004B2
公开(公告)日：2018-03-20
申请号：US14925787
申请日：2015-10-28
发明人： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
CPC分类号： F28D15/046 , B23P15/26 , B81C1/00388 , B81C2201/0108 , C23F4/00 , F28D15/0233 , F28F13/187
摘要： Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US12104856B2
公开(公告)日：2024-10-01
申请号：US15787455
申请日：2017-10-18
发明人： Ryan John Lewis , Ronggui Yang , Yung-Cheng Lee
IPC分类号： F28D15/04 , F28D15/02 , H01L23/427 , H01L23/433 , B23P15/26
CPC分类号： F28D15/046 , F28D15/02 , F28D15/0233 , F28D15/04 , H01L23/427 , H01L23/433 , B23P15/26
摘要： Some embodiments of the invention include a thermal ground plane with a variable thickness vapor core. For example, a thermal ground plan may include a first casing and a second casing where the second casing and the first casing configured to enclose a working fluid. The thermal ground plane may also include an evaporator region disposed at least partially on at least one of the first casing and the second casing; a condenser region disposed at least partially on at least one of the first casing and the second casing; and a wicking layer disposed between the first casing and the second casing a vapor core defined at least partially by a gap between the first casing and the second casing. The thickness of the gap can vary across the first casing and the second casing.
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公开(公告)号：US11598594B2
公开(公告)日：2023-03-07
申请号：US15930016
申请日：2020-05-12
发明人： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
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