公开(公告)号：US20230332841A1

公开(公告)日：2023-10-19

申请号：US18180122

申请日：2023-03-07

申请人： Kelvin Thermal Technologies, Inc.

发明人： Ryan John Lewis ,  Li-Anne Liew ,  Ching-Yi Lin ,  Collin Jennings Coolidge ,  Shanshan Xu ,  Ronggui Yang ,  Yung-Cheng Lee

IPC分类号： F28D15/04

CPC分类号： F28D15/046

摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

公开(公告)号：US11598594B2

公开(公告)日：2023-03-07

申请号：US15930016

申请日：2020-05-12

申请人： Kelvin Thermal Technologies, Inc.

发明人： Ryan John Lewis ,  Li-Anne Liew ,  Ching-Yi Lin ,  Collin Jennings Coolidge ,  Shanshan Xu ,  Ronggui Yang ,  Yung-Cheng Lee

IPC分类号： F28F21/08 ,  F28D15/02 ,  F28D15/04

摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

公开(公告)号：US10731925B2

公开(公告)日：2020-08-04

申请号：US14857567

申请日：2015-09-17

申请人： Kelvin Thermal Technologies, Inc.

发明人： Ryan John Lewis ,  Li-Anne Liew ,  Ching-Yi Lin ,  Collin Jennings Coolidge ,  Shanshan Xu ,  Ronggui Yang ,  Yung-Cheng Lee

IPC分类号： F28D15/04 ,  F28D15/02 ,  F28F21/08 ,  G06F1/20 ,  H01L23/427 ,  H05K7/20

摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.

公开(公告)号：US20200300563A1

公开(公告)日：2020-09-24

申请号：US15930016

申请日：2020-05-12

申请人： Kelvin Thermal Technologies, Inc.

发明人： Ryan John Lewis ,  Li-Anne Liew ,  Ching-Yi Lin ,  Collin Jennings Coolidge ,  Shanshan Xu ,  Ronggui Yang ,  Yung-Cheng Lee

IPC分类号： F28F21/08 ,  F28D15/02 ,  F28D15/04

摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.