摘要:
This painting system includes a body transport device transporting a body, a painting robot fixedly set at a first height, painting at least an inner portion of a door of the body while changing a posture to follow transport of the body by the body transport device, and a door opening/closing robot fixedly set at a second height different from the first height.
摘要:
A picking system includes a conveyer, a robot, and a control device. The conveyer conveys workpieces. The robot includes a plurality of holding parts and a supporting part. The holding parts hold the workpieces. The supporting part is rotatably provided against an arm to support the plurality of holding parts. Then, the control device instructs the robot to rotate the supporting part by a predetermined amount in such a manner that the direction of the workpiece becomes a predetermined direction for each the workpiece held by the holding parts and then to place the workpiece on a predetermined place.
摘要:
A picking system includes a conveyer, a robot, a main camera, and a control device. The conveyer conveys workpieces. The robot performs a holding operation and a moving operation on the workpieces. The main camera captures the transport path of the conveyer. The control device detects the workpiece on the basis of the image captured by the main camera and instructs the robot to perform the holding operation on the detected workpiece. Moreover, the control device instructs the robot to perform the holding operation on the overlapped workpieces when the overlapping of the workpieces is detected.
摘要:
An objective of this invention is to solve the problem that in ALD film deposition using a vertical batch processing machine advantageous for improving a throughput, reliability in a dielectric body formed on the bottom of a hole such as a capacitor formed on a semiconductor substrate is reduced as the hole is finer and deeper.A dielectric body is formed by an ALD film deposition process comprising a gas flow sequence where a purging step after supplying a source and a reactant gases is a two-stage purging of vacuum purging and gas purging and the step of supplying a reactant gas is further divided. The process allows a highly reliable dielectric body to be formed in the bottom of a deep hole, contributing to improvement in reliability of a capacitor and a semiconductor device.